Gemalto M2M GmbH EMS31-VR1 ユーザーズマニュアル
Cinterion
®
EMS31-V Hardware Interface Overview
2.2 RF Antenna Interface
18
EMS31_V_HIO_v00.004
2018-02-27
Confidential / Preliminary
Page 16 of 35
2.2.1
Antenna Instalation
The distance between the antenna RF pads and its neighboring GND pads has been optimized
for best possible impedance. On the application PCB, special attention should be paid to these
3 pads, in order to prevent mismatch.
for best possible impedance. On the application PCB, special attention should be paid to these
3 pads, in order to prevent mismatch.
The wiring of the antenna connection line, starting from the antenna pad to the application an-
tenna should result in a 50
tenna should result in a 50
Ω
line impedance. Line width and distance to the GND plane needs
to be optimized with regard to the PCB’s layer stack.
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the application PCB, it is recommended to realize the antenna connection line
using uninterrupted ground plane and embedded Stripline rather than Microstrip line technolo-
gy.
speed clocks on the application PCB, it is recommended to realize the antenna connection line
using uninterrupted ground plane and embedded Stripline rather than Microstrip line technolo-
gy.
For type approval purposes (i.e., FCC KDB 996369 related to modular approval requirements)
an external application must connect the RF signal in one of the following ways:
an external application must connect the RF signal in one of the following ways:
•
Via 50
Ω
coaxial antenna connector (common connectors are U-FL or SMA) placed as close
as possible to the module's antenna pad.
•
By soldering the antenna to the antenna connection line on the application’s PCB (without
the use of any connector) as close as possible to the module’s antenna pad.
the use of any connector) as close as possible to the module’s antenna pad.
•
By routing the application PCB's antenna to the module’s antenna pad in the shortest way.
Awareness for ESD protection on the RF interfaces should also be considered. This
protection could be utilized through the pi-network above (primarily for managing any
additional RF optimization needs) or by additional component addition in series with the above
pi-network matching.
protection could be utilized through the pi-network above (primarily for managing any
additional RF optimization needs) or by additional component addition in series with the above
pi-network matching.