Wistron NeWeb Corporation UMC-6055Q ユーザーズマニュアル
Product specification
18
6.
APPLICATION DESIGN NOTES
6.1 Layout Notes
6.2 RF Pin Input Impedance Matching
Applications utilizing the module must ensure that a 50Ω controlled impedance trace is used. Shown in the
accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for
Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the
Description column in the table below.
Layer
Material
Type
Type
Dielectric
Thickness
Thickness
Trace
Width
Width
Copper
Thickness
Thickness
Dielectric
Constant
Constant
Char.
Impedance
Impedance
Description
1
Conductive
-
27
2.1
-
50 Microstrip
Dielectric
16
-
-
4.3
- Prepreg
2
Conductive
-
-
1.4
- Plane
Dielectric
20
4.3
- Prepreg
3
Conductive
-
-
1.4
-
- Plane
Dielectric
16
-
-
4.3
- Prepreg
4
Conductive
-
27
2.1
-
50 Microstrip
Table 6-1-1-1 Application Board Characteristic Impedance
Figure 6-1-1-1 Application Board Layer Stack Up
6.3 Handling Requirements
DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING.
6.4 Soldering Requirements
Soldering Iron Soldering
Solder Temperature: 350oC
Immersion Duration: 2 ~ 3 seconds
Solder Temperature: 350oC
Immersion Duration: 2 ~ 3 seconds