Laird Controls North America Inc. 7700L ユーザーズマニュアル
406.1125-419.9875MHz GFSK version (7700L)
Introduction
Document p/n: 9S01-7700-A301, rev. 2
Cattron-Theimeg Inc.
Proprietary and Confidential
1-3
Table of Contents
1.
INTRODUCTION ............................................................................................................................................1-5
1.1.
P
URPOSE
..........................................................................................................................................................1-5
1.2.
S
COPE
..............................................................................................................................................................1-5
1.3.
D
EFINITIONS
,
A
CRONYMS
,
A
BBREVIATIONS
...................................................................................................1-5
1.3.1.
Definitions ..........................................................................................................................................1-5
1.3.2.
Acronyms ............................................................................................................................................1-5
1.3.3.
Abbreviations ......................................................................................................................................1-6
1.4.
R
EFERENCES
....................................................................................................................................................1-6
1.5.
O
VERVIEW
.......................................................................................................................................................1-6
1.5.1.
Notation Conventions .........................................................................................................................1-6
2.
OVERALL DESCRIPTION ............................................................................................................................2-1
2.1.
P
RODUCT
P
ERSPECTIVE
...................................................................................................................................2-1
2.1.1.
User Interfaces ....................................................................................................................................2-1
2.1.2.
Hardware Interfaces ............................................................................................................................2-1
2.1.3.
Software Interfaces .............................................................................................................................2-1
2.2.
P
RODUCT
F
UNCTIONS
......................................................................................................................................2-1
2.3.
U
SER
C
HARACTERISTICS
.................................................................................................................................2-2
2.4.
C
ONSTRAINTS
..................................................................................................................................................2-2
2.5.
A
SSUMPTIONS AND
D
EPENDENCIES
.................................................................................................................2-2
3.
SPECIFIC REQUIREMENTS ........................................................................................................................3-3
3.1.
E
XTERNAL
I
NTERFACE
R
EQUIREMENTS
..........................................................................................................3-3
3.1.1.
Interfaces.............................................................................................................................................3-3
3.1.1.1
50 Pin Header I/O. ..............................................................................................................................3-3
3.1.2.
Software Interface Requirements ........................................................................................................3-4
3.2.
S
YSTEM
F
EATURES
..........................................................................................................................................3-4
3.2.1.
EEPROM ............................................................................................................................................3-4
3.2.2.
Programmable Output Power ..............................................................................................................3-4
3.2.3.
Software Configurable ........................................................................................................................3-5
3.2.4.
Low Cost VCO ...................................................................................................................................3-5
3.3.
P
ERFORMANCE
R
EQUIREMENTS
......................................................................................................................3-5
3.3.1.
Frequency Range ................................................................................................................................3-5
3.3.2.
Switching range ..................................................................................................................................3-5
3.3.3.
Alignment Ranges ..............................................................................................................................3-5
3.3.4.
Power ..................................................................................................................................................3-5
3.3.5.
Frequency Error and Drift ...................................................................................................................3-5
3.3.6.
Adjacent and co channel power ..........................................................................................................3-6
3.3.7.
Transient Emissions ............................................................................................................................3-7
3.3.8.
Modulation ..........................................................................................................................................3-8
3.3.9.
Keying ................................................................................................................................................3-8
3.4.
D
ESIGN
C
ONSTRAINTS
.....................................................................................................................................3-8
3.4.1.
Standards Compliance ........................................................................................................................3-8
3.4.2.
Mechanical Dimensions ......................................................................................................................3-9
3.4.3.
Power Requirements .........................................................................................................................3-10
3.4.4.
Software Requirements .....................................................................................................................3-10
3.4.5.
RF Exposure Requirements ..............................................................................................................3-11
3.5.
S
YSTEM
A
TTRIBUTES
....................................................................................................................................3-11
3.5.1.
Reliability .........................................................................................................................................3-11
3.5.2.
Availability .......................................................................................................................................3-11