Multi-Tech Systems 92U03G23720 ユーザーズマニュアル

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Chapter 3 – Electrical Characteristics
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide
    
31
GND
SIMVCC
IK
1
SIMRST
SIMCLK
SIMDATA
SIMPRES1 8
7
3
2
VCC
RST
CLK
CC4
GND
VPP
I/O
CC8
Figure 3-12: SIM Socket
SPI Bus
The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard. The
maximum speed transfer is 3.25Mb/s.
Table 3-26 : SPI Bus Pin Description
Signal
Pin Number
I/O
I/O Type*
Description
SPI_CLK
44
O
1X
SPI Serial Clock
SPI_IO
43
I/O
CMOS/1X
SPI Data
SPI_EO
42
O
1X
SPI Enable
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Keypad Interface
This interface provides 10 connections: 5 rows (R0 to R4) and 5 columns (C0 to C4).
The scanning is a digital one, and the de-bouncing is done in the integrated modem. No discrete components
like R, C (Resistor, Capacitor) are needed.  It is possible to scan the column and rows using the AT+CMER
command.  See AT Command manual for more details.
Table 3-27: Keypad Interface Pin Description
Signal
Pin Number
I/O
I/O Type*
Description
ROW0
39
I/O
CMOS / 1X
Row scan
ROW1
40
I/O
CMOS / 1X
Row scan
ROW2
37
I/O
CMOS / 1X
Row scan
ROW3
38
I/O
CMOS / 1X
Row scan
ROW4
35
I/O
CMOS / 1X
Row scan
COL0
36
I/O
CMOS / 1X
Column scan
COL1
33
I/O
CMOS / 1X
Column scan
COL2
34
I/O
CMOS / 1X
Column scan
COL3
31
I/O
CMOS / 1X
Column scan
COL4
32
I/O
CMOS / 1X
Column scan
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.