Multi-Tech Systems 92U12616852 ユーザーズマニュアル

INDEX

Index

A

ESD ................................................................................15
European Community Directives ..................................36

account activation.........................................................47
activation

cellular devices.........................................................47

F

antenna .........................................................................42

FCC

cable....................................................................43 45

grant notes...............................................................45

cellular devices.........................................................42

frequency bands ...........................................................62

GPS...........................................................................44
Wi-Fi RF....................................................................44

assembly diagram .........................................................18

G

GPS

B

antenna....................................................................44

ground plane.................................................................14

Bluetooth ......................................................................47
build options ..............................................................6 47

H

C

handling precautions due to ESD..................................15
hazardous substances ...................................................37

cable.........................................................................43 45

host labeling..................................................................45

CAD drawing.............................................................49 50

HSPA+............................................................................34

CE mark .........................................................................36

HSPA+21........................................................................47

Chinese hazardous substances

Chinese version........................................................41
English version .........................................................40

I

C programming

IMEI ...............................................................................34

close .........................................................................72

install

open .........................................................................70

SIM card ...................................................................31

read ..........................................................................71

installing

test program ............................................................73

device on board .......................................................31

write.........................................................................72

J

D

jumpers .........................................................................30

developer board............................................................16
device

maintenance ............................................................33

L

dialing restrictions.........................................................37
drawing ....................................................................49 50

labeling

host ..........................................................................45

labels .............................................................................34

E

Linux

building driver..........................................................64

electrical

C programming ........................................................70

characteristics ..........................................................53

driver........................................................................47

electromagnetic interference .......................................14

install........................................................................63

electrostatic discharge ..................................................15

PPP connection ........................................................69

EMI ................................................................................14

MultiConnect

TM

PCIe MTPCIE-H5/MTPCIE-BW Developer Guide

75