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BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7
Page 3 of 34
Table of Contents
1.
FEATURES ............................................................................................................................................................................... 1
2.
APPLICATIONS ........................................................................................................................................................................ 1
3.
ORDERING INFORMATION...................................................................................................................................................... 2
4.
BLOCK DIAGRAM .................................................................................................................................................................... 2
5.
QUICK SPECIFICATIONS .......................................................................................................................................................... 5
6.
PIN DESCRIPTIONS ................................................................................................................................................................. 6
6.1
BMD-300
/
BMD-301 ..................................................................................................................................................................... 6
6.2
BMD-350 ....................................................................................................................................................................................... 7
6.3
R
IG
DFU
P
IN
F
UNCTIONS
..................................................................................................................................................................... 9
6.4
BMD
WARE
P
IN
F
UNCTIONS
................................................................................................................................................................. 9
7.
ELECTRICAL SPECIFICATIONS ................................................................................................................................................ 10
7.1
A
BSOLUTE
M
AXIMUM
R
ATINGS
........................................................................................................................................................... 10
7.2
O
PERATING
C
ONDITIONS
................................................................................................................................................................... 10
7.3
G
ENERAL
P
URPOSE
I/O ..................................................................................................................................................................... 10
7.4
M
ODULE
RESET ............................................................................................................................................................................. 10
7.5
D
EBUG
&
P
ROGRAMMING
................................................................................................................................................................. 11
7.6
C
LOCKS
.......................................................................................................................................................................................... 11
8.
FIRMWARE ........................................................................................................................................................................... 13
8.1
F
ACTORY
I
MAGE
.............................................................................................................................................................................. 13
8.1.1
Firmware Version ‘AA’ .............................................................................................................................................................. 13
8.1.2
Firmware Version ‘AB’ .............................................................................................................................................................. 13
8.1.3
Module Programming and Read-Back Protection .................................................................................................................... 13
8.2
S
OFT
D
EVICES
.................................................................................................................................................................................. 14
8.2.1
S132 .......................................................................................................................................................................................... 14
8.2.2
S212 .......................................................................................................................................................................................... 14
8.2.3
S332 .......................................................................................................................................................................................... 15
8.3
MAC
A
DDRESS
I
NFO
........................................................................................................................................................................ 15
9.
MECHANICAL DATA .............................................................................................................................................................. 16
9.1
M
ECHANICAL
D
IMENSIONS
................................................................................................................................................................. 16
9.1.1
BMD-300 Dimensions ............................................................................................................................................................... 16
9.1.2
BMD-301 Dimensions ............................................................................................................................................................... 16
9.1.3
BMD-350 Dimensions ............................................................................................................................................................... 17
9.2
R
ECOMMENDED
PCB
L
AND
P
ADS
........................................................................................................................................................ 17
9.2.1
BMD-300/301 ........................................................................................................................................................................... 17
9.2.2
BMD-350 ................................................................................................................................................................................... 18
10.
MODULE MARKING .............................................................................................................................................................. 18
10.1
BMD-300
M
ODULE
M
ARKING
.......................................................................................................................................................... 18
10.2
BMD-301
M
ODULE
M
ARKING
.......................................................................................................................................................... 19
10.3
BMD-350
M
ODULE
M
ARKING
.......................................................................................................................................................... 19
11.
RF DESIGN NOTES ................................................................................................................................................................. 20
11.1
R
ECOMMENDED
RF
L
AYOUT
&
G
ROUND
P
LANE
..................................................................................................................................... 20
11.1.1
BMD-300 ................................................................................................................................................................................... 20
11.1.2
BMD-301 ................................................................................................................................................................................... 20
11.1.3
BMD-350 ................................................................................................................................................................................... 20
11.2
M
ECHANICAL
E
NCLOSURE
.................................................................................................................................................................. 21
11.3
A
NTENNA
P
ATTERNS
......................................................................................................................................................................... 22
11.3.1
BMD-300 ................................................................................................................................................................................... 22
11.3.2
BMD-350 ................................................................................................................................................................................... 24
12.
EVALUATION BOARDS .......................................................................................................................................................... 25
13.
CUSTOM DEVELOPMENT ...................................................................................................................................................... 25
14.
BLUETOOTH QUALIFICATION ................................................................................................................................................ 26
15.
REGULATORY STATEMENTS .................................................................................................................................................. 26
15.1
FCC
S
TATEMENT
: ............................................................................................................................................................................ 26
15.2
FCC
I
MPORTANT
N
OTES
: ................................................................................................................................................................... 30
15.3
IC
S
TATEMENT
: ............................................................................................................................................................................... 28
15.4
IC
I
MPORTANT
N
OTES
: ...................................................................................................................................................................... 28
15.5
CE
R
EGULATORY
: ............................................................................................................................................................................. 29
15.6
J
APAN
(MIC) .................................................................................................................................................................................. 29
15.7
A
USTRALIA
/
N
EW
Z
EALAND
............................................................................................................................................................... 30
15.8
A
PPROVED
E
XTERNAL
A
NTENNAS
......................................................................................................................................................... 30
16.
SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 31
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