Shanghai SIMCom Wireless Solutions Limited SIM7000A ユーザーズマニュアル
Smart Machine Smart Decision
SIM7000 _Hardware Design _V1.00
2017-05-23
6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 33: The ramp-soak-spike reflow profile of SIM7000
Note: For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
SIM7000 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 34: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
stated
1
Unlimited at ≦30℃/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the