Intel III Xeon 500 MHz 80525KX500512 ユーザーズマニュアル
製品コード
80525KX500512
Pentium
®
III Xeon™ Processor at 500 and 550 MHz
Datasheet
55
areas on the cover have been characterized and are illustrated in
. If no external heat
sources are present, T
COVER
thermal measurements should be made at these points. The cover is
not designed for thermal solution attachment.
NOTE:
8. Four thermocouple attach locations at
±
0.015". Thermocouple measurement locations are the expected high
temperature locations, without external heat source influence. Temperature of entire cover surface not to
exceed 7
exceed 7
°
C. Ensure that external heat sources do not cause a violation of T
COVER
requirements.
6.0
Mechanical Specification
Pentium
III
Xeon processors use S.E.C. cartridge package technology. The S.E.C. cartridge
contains the processor core, L2 cache and other components. The S.E.C. cartridge package
connects to the baseboard through an edge connector. Mechanical specifications for the processor
are given in this section. See
connects to the baseboard through an edge connector. Mechanical specifications for the processor
are given in this section. See
for a complete terminology listing.
shows the thermal plate side view and the cover side view of the Pentium
III
Xeon
processor.
shows the Pentium
III
Xeon S.E.C. cartridge cooling solution attachment
feature details on the thermal plate and depict package form factor dimensions and retention
enabling features of the S.E.C. cartridge. The processor edge connector defined in this document is
referred to as SC330. See the SC330 connector specifications for further details on the edge
connector.
enabling features of the S.E.C. cartridge. The processor edge connector defined in this document is
referred to as SC330. See the SC330 connector specifications for further details on the edge
connector.
Figure 23.
Guideline Locations for Cover Temperature (T
COVER
) Thermocouple Placement