HP 460c G7 637391-B21+UK066E データシート

製品コード
637391-B21+UK066E
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HP ProLiant BL460c G7 Server Blade
Technical specifications
Processor
Number of processors
1 or 2
Maximum number of cores
6
Processors supported
Intel Xeon 5500 and 5600 series 
Low-wattage processor offerings
Yes
Cache
Up to 12 MB L3 per process
Processor speed 
Up to 3.20 GHz
Memory
Memory type
PC3-10600 DDR3 RDIMM and UDIMM 
Standard memory
6 GB or 12 GB (preconfigured models) 
Maximum memory
384 GB
Advanced memory protection
• Advanced ECC (multi-bit error protection)
• Memory Mirroring Mode
• Memory Lock-Step Mode
• Memory Online Spare Mode (Intel Xeon 5600 series processors) 
Memory slots
12 DIMM slots
Networking and I/O
Integrated network adapter 
Two embedded HP 10 Gb NC553i FlexFabric Converged Network Adapter ports
I/O expansion slots 
Two PCIe Gen2
Standard/maximum I/O bandwidth  20 Gb/60 Gb
Networking options 
Multiple, redundant port 10 Gb FlexFabric, 10GbE Flex-10, 10 Gb and 1 Gb Ethernet, and QDR (40 Gb) InfiniBand
Storage
Storage type
Hot-plug SFF SAS/SATA/SSD
Maximum internal storage
(2) SFF hot-plug drive bays 2.0TB
Integrated storage controller
6 Gb HP Smart Array P410i Controller with RAID 0 and 1 and optional FBWC options to 1 GB
Storage options
• 4 Gb and 8 Gb Fibre Channel mezzanine adapters (Brocade, Emulex, and QLogic options)
•  Smart Array Controller mezzanines options with battery-backed write cache (BBWC) or FBWC to 1 GB for connection to external  
direct-attached or shared storage
• I/O accelerator cards for high-performance I/O
• HP Ultrium Tape Blades for an integrated direct-attached data protection solution
• HP D2200sb PCIe Storage Blades for direct-attached and shared storage within the c-Class enclosures
• Compatible with HP Modular Smart Array, Enterprise Virtual Array, and select third-party SANs 
Deployment
Form factor
Half-height, single, wide server blade; 16 server blades per c7000 Enclosure, 8 server blades per c3000 Enclosure
System management
• HP iLO 3
 • HP Insight Foundation
 • BladeSystem enclosure HP Onboard Administrator (OA) with KVM (optional redundant OA)
 • HP Insight Control (optional)
• HP Insight Dynamics for ProLiant (optional)
Other
Power
• True N+N redundant hot-plug, high-efficiency, enclosure-based power supplies
 • Redundant hot-plug HP Active Cool fans
 • HP Thermal Logic Technology and Sea of Sensors
 • HP Dynamic Power Savings Mode
 • HP Power Regulator
 • Parallel Redundant Scalable Enclosure Cooling (PARSEC) design
• Power workload balancing
 • Enclosure-based HP Dynamic Power Capping
 • Enclosure-based common power supply form factor
 • Low voltage DDR3 RDIMMs (LVDIMM) (Intel Xeon 5600 series processors)