Intel R1304BTSSFANR ユーザーズマニュアル
Introduction
Intel
®
Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
2
Revision 2.1
Intel order number G17455-005
Glossary
Reference Documents
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel
components that need adequate airflow to cool. Intel
®
ensures through its own chassis
development and testing that when Intel
®
server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel
responsibility of the system integrator who chooses not to use Intel
®
developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.