Intel R1304BB4GS9 プリント
Energy Efficient
Unique spread core design
Low watt dual Intel® Xeon®
processors E5-2400v2
Low watt dual Intel® Xeon®
processors E5-2400v2
Price Performance
Supports two Intel® Xeon Phi™
coprocessors
12 DIMMS on 6 memory channels
Extensive I/O flexibility
coprocessors
12 DIMMS on 6 memory channels
Extensive I/O flexibility
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server products visit:
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For product specifications
visit:
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visit:
intel.com/support/
motherboards/server/sb/
CS-032524.htm
Copyright © 2013 Intel Corporation. All rights reserved.
327579-002US
1213/GMcK/MandishDesign/PDF
Intel® Server Board S2400BB Product Family Technical Specifications
Form Factor
1U rack: 1.75” x 17.2” x 24.75”
2U rack: 3.5” x 17.2” x 24.75”
2U rack: 3.5” x 17.2” x 24.75”
Board Included
S2400BB4
Processors Supported
Dual Intel® Xeon® processor E5 2400 or E5 2400v2 product family, up to 95W
Up to 2 Intel® Xeon Phi™ coprocessors
Up to 2 Intel® Xeon Phi™ coprocessors
1
Total Slots
8 + 1
Slot Types
2 x PCI Express* 3.0 x16
6 x PCI Express 3.0 x8
1 x PCI Express 2.0 x8 via I/O expansion module
6 x PCI Express 3.0 x8
1 x PCI Express 2.0 x8 via I/O expansion module
Memory Capacity
12 LR / U / RDIMMs with 1333MT/s, 1600MT/s, ECC
384 GB max
384 GB max
Drive Options
1U rack: 8 x 2.5” or 4 x 3.5” hot-swap HDDs
2U rack: 8/16/24 x 2.5” or 8/12 x 3.5” hot-swap HDDs
2U rack: 8/16/24 x 2.5” or 8/12 x 3.5” hot-swap HDDs
System Cooling
Redundant cooling fans
Power Supply Options
460 W AC Redundant PSU (Gold Efficiency), 750 W AC Redundant PSU
(Platinum Efficiency)
Module Upgrades
Intel® I/O Module
Intel® Integrated RAID ROC or IOC Module
Intel® Remote Management Module 4
TPM Module
Intel® Integrated RAID ROC or IOC Module
Intel® Remote Management Module 4
TPM Module
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions
marked “reserved” or “undefined”. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized
errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, the Intel logo, Intel Inside, Intel Xeon Phi, Xeon and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Intel, the Intel logo, Intel Inside, Intel Xeon Phi, Xeon and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
1U rack 2.5” or 3.5” Drives
R1208BB4DC
R1208BB4DC
8 x 2.5” hot-swap HDD
2 x 460 W AC Redundant PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R1304BB4DC
4 x 3.5” hot-swap HDD
2 x 460 W AC Redundant PSU
Intel® RMM4 included
R1208BB4GS9
8 x 2.5” hot-swap HDD
750 W AC Redundant PSU
Intel® RMM4 included
R1304BB4GS9
4 x 3.5” hot-swap HDD
750 W AC Redundant PSU
Intel® RMM4 included
2U rack 2.5” Drives
R2208BB4GC
R2208BB4GC
8 x 2.5” hot-swap HDD
2 x 750 W AC Redundant PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R2208BB4GS9
8 x 2.5” hot-swap HDD
750 W AC Redundant PSU
2U rack 3.5” Drives
R2308BB4GC
R2308BB4GC
8 x 3.5” hot-swap HDD
2 x 750 W AC Redundant PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R2312BB4GS9
12 x 3.5” hot-swap HDD
750 W AC Redundant PSU
1
Intel® Xeon Phi™ coprocessor support depends on the
board and chassis configuration. See your sales
representative for more details
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SALE AND/OR USE OF INTEL PRODUCTS
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UNLESS OTHERWISE AGREED IN WRITING BY
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