Intel Edison Compute Module (IoT) EDI2.SPOF.AL.MP プリント

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Please Recycle

331179-001

Form factor

Board with 70-pin connector

Dimensions

35.5 × 25.0 × 3.9 mm (1.4 × 1.0 × 0.15 inches) max

C/M/F

Blue PCB with shields / No enclosure

Connector

Hirose DF40 Series (1.5, 2.0, or 3.0 mm stack height)

Operating temperature

32 to 104°F (0 to 40°C)

Total of 40 GPIOs, which can be configured as:
SD card

1 interface

UART

2 controllers (1 full flow control, 1 Rx/Tx) 

I2C

2 controllers

SPI

1 controller with 2 chip selects

I2S

1 controller

GPIO

Additional 12 (with 4 capable of PWM)

USB 2.0

1 OTG controller

Clock output 

32 kHz, 19.2 MHz

 SoC

22 nm Intel® SoC that includes a dual-core, dual-threaded Intel® Atom™ CPU at 500 MHz and a 32-bit 

Intel® Quark™ microcontroller at 100 MHz

RAM

1 GB LPDDR3 POP memory

(2 channel 32bits @ 800MT/sec)

Flash storage

4 GB eMMC  (v4.51 spec)

 WiFi

 Broadcom* 43340 802.11 a/b/g/n;

 Dual-band (2.4 and 5 GHz)

 Onboard antenna or external antenna (SKU configurations)

Bluetooth

Bluetooth 4.0

Input

3.3 to 4.5 V 

Output

100 ma @3.3 V and 100 ma @ 1.8 V

Power

Standby (No radios): 13 mW 

Standby (Bluetooth 4.0): 21.5 mW (BTLE in Q4-14)

Standby (Wi-Fi): 35 mW

CPU OS

Yocto Linux* v1.6

Development environments

Arduino* IDE

Eclipse supporting: C, C++, and Python

Intel XDK supporting: Node.JS and HTML5

MCU OS

RTOS 

Development environments

MCU SDK and IDE