Intel SR1640TH SR1640THNA ユーザーズマニュアル

Cooling Sub-System 

Intel® Server System SR1640TH TPS 

  

Revision 

1.0 

Intel order number: E94847-001 

72 

Several components and configuration requirements make up the cooling sub-system of the 
chassis. These include processors, chipsets, VR heatsinks, system fan module, power 
supply fans, CPU air duct, and drive bay population. All are necessary to provide and 
regulate the air flow and air pressure needed to maintain the system’s thermals when 
operating at or below the maximum specified thermal limits. 

In order to maintain the necessary airflow within the system, you must properly install the air 
duct in each tray. 

The chassis uses a variable fan speed control engine to provide adequate cooling for the 
system at various ambient temperature conditions, under various server workloads, and with 
the least amount of acoustic noise possible. The fans operate at the lowest speed for any 
given condition to minimize acoustics. 

Note: The server system does not support redundant cooling fans. If any of the fans fail, you 
must power down the system as soon as possible to replace the fan. 

Four heatsinks are included in the system package. These heatsinks are designed for 
optimal cooling and performance. Each processor is cooled by a passive heatsink. To 
achieve better cooling performance, you must properly attach the heatsink bottom base with 
TIM (thermal interface material). ShinEtsu* G-751 or 7783D or Honeywell* PCM45F TIM is 
recommended. The mechanical performance of the heatsink must satisfy mechanical 
requirement of Intel

®

 Xeon

®

 processors. To keep chipsets and VR temperature at or below 

maximum temperature limit, the heatsink is required if necessary. 

 

Note: The passive heatsink is the third part thermal solution for 1U rack chassis.