Intel Server System SR1530HSH SR1530HSHNA ユーザーズマニュアル
製品コード
SR1530HSHNA
To build your system and get more details on server confi gurations from Intel visit:
www.intel.com/go/serverconfi gurator
For more details on Intel® Server Systems SR1530SH/SR1530HSH, visit:
www.intel.com/design/servers/platforms/sr1530SH/index.htm
For more information on Intel® Server Products, visit:
www.intel.com/go/serverproducts
For more information on how to make the Intel® Server Systems SR1530SH and SR1530HSH part of your server environment,
please contact an Intel® Channel Partner Program participant.
Technical Specifi cations
System Memory
Capacity
Four DIMM sockets for up to 8GB of un-buffered
ECC/non-ECC DDR2 667 or 800 memory
Reliability Features
Reliability features: corrects single-bit errors,
detects double-bit errors (using ECC memory)
Four DIMM sockets for up to 8GB of un-buffered
ECC/non-ECC DDR2 667 or 800 memory
Reliability Features
Reliability features: corrects single-bit errors,
detects double-bit errors (using ECC memory)
Intel® Server Management
Integrated Management Type
iBMC with IPMI 2.0 support
Software Support
Intel® System Management Software 2.0
Supported Operating Systems
Microsoft* Windows* Server 2003 Enterprise Edition,
Microsoft Windows 2000 Advanced Server,
Red Hat* Linux* Enterprise 4.0,
SuSE* Linux* Enterprise Server and
Novell* NetWare* 6.5
iBMC with IPMI 2.0 support
Software Support
Intel® System Management Software 2.0
Supported Operating Systems
Microsoft* Windows* Server 2003 Enterprise Edition,
Microsoft Windows 2000 Advanced Server,
Red Hat* Linux* Enterprise 4.0,
SuSE* Linux* Enterprise Server and
Novell* NetWare* 6.5
Mechanical
Board Style
SSI ATX
Board Size
12” x 9.6” (305 mm x 244 mm)
SSI ATX
Board Size
12” x 9.6” (305 mm x 244 mm)
Environment
Ambient Temperature
Operating (system): +10°C to +35°C;
Non-operating/storage (system): -40°C to +70°C ambient
Relative Humidity
Non-operating: 95%, non-condensing at +30°C
Operating (system): +10°C to +35°C;
Non-operating/storage (system): -40°C to +70°C ambient
Relative Humidity
Non-operating: 95%, non-condensing at +30°C
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Xeon, and Intel SpeedStep are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved.
Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Xeon, and Intel SpeedStep are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved.
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