Texas Instruments DAC7741 Evaluation Module DAC7741EVM DAC7741EVM データシート
製品コード
DAC7741EVM
www.ti.com
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Physical Description
7.1
PCB Layout
+15V
-15V
Physical Description
This section describes the physical characteristics and PCB layout of the EVM and lists the components
used on the module.
used on the module.
The EVM is constructed on a four-layer printed-circuit board using a copper-clad FR-4 laminate material.
The printed-circuit board has a dimension of 96,52 mm (3.80 inch) X 102,87 mm (4.050 inch), and the
board thickness is 1,57 mm (0.062 inch).
The printed-circuit board has a dimension of 96,52 mm (3.80 inch) X 102,87 mm (4.050 inch), and the
board thickness is 1,57 mm (0.062 inch).
through
show the individual artwork layers.
Figure 2. Top Silkscreen
DAC7741EVM
SLAU093A – October 2002 – Revised May 2005
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