Microchip Technology MCP1630RD-DDBK3 ユーザーズマニュアル
MCP1630V BIDIRECTIONAL 4 CELL
LI-ION CHARGER REFERENCE
DESIGN USER’S GUIDE
© 2006 Microchip Technology Inc.
DS51641A-page iii
Table of Contents
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 2
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History ................................................................................... 3
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 2
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History ................................................................................... 3
1.1 Introduction ..................................................................................................... 5
1.2 What is the MCP1630V Bidirectional 4 Cell Li-Ion Charger
1.2 What is the MCP1630V Bidirectional 4 Cell Li-Ion Charger
2.4 Introduction ..................................................................................................... 7
2.5 Features ......................................................................................................... 7
2.6 Getting Started ............................................................................................... 8
2.5 Features ......................................................................................................... 7
2.6 Getting Started ............................................................................................... 8
A.1 Introduction .................................................................................................. 11
A.2 Schematic - Sheet 1 ................................................................................... 12
A.3 Schematic - Sheet 2 ................................................................................... 13
A.4 Board – Top Silk Layer ............................................................................... 14
A.5 Board – Top Metal Layer ............................................................................ 15
A.6 Board – Mid Layer1 .................................................................................... 16
A.7 Board – Mid Layer2 .................................................................................... 17
A.8 Board – Metal Layer ................................................................................... 18
A.9 Board – Bottom Silk Layer ......................................................................... 19
A.2 Schematic - Sheet 1 ................................................................................... 12
A.3 Schematic - Sheet 2 ................................................................................... 13
A.4 Board – Top Silk Layer ............................................................................... 14
A.5 Board – Top Metal Layer ............................................................................ 15
A.6 Board – Mid Layer1 .................................................................................... 16
A.7 Board – Mid Layer2 .................................................................................... 17
A.8 Board – Metal Layer ................................................................................... 18
A.9 Board – Bottom Silk Layer ......................................................................... 19
Appendix B. Bill Of Materials (BOM) .......................................................................... 21
Appendix C. Firmware ................................................................................................. 23
Appendix C. Firmware ................................................................................................. 23