Microchip Technology MCP2200EV-VCP データシート
MCP2200
DS22228B-page 28
2011 Microchip Technology Inc.
TABLE 3-2:
THERMAL CONSIDERATIONS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40
Operating temperature -40
C T
A
+85C (I-Temp)
Param
No.
Sym
Characteristic
Typ
Units
Conditions
TH01
θ
JA
Thermal Resistance Junction to
Ambient
Ambient
85.2
C/W
20-pin SOIC package
108.1
C/W
20-pin SSOP package
36.1
C/W
20-pin QFN 5x5 mm package
TH02
θ
JC
Thermal Resistance Junction to
Case
Case
24
C/W
20-pin SOIC package
24
C/W
20-pin SSOP package
1.7
C/W
20-pin QFN 5x5 mm package
TH03
T
JMAX
Maximum Junction Temperature
150
C
TH04
PD
Power Dissipation
—
W
PD = P
INTERNAL
+ P
I
/
O
TH05
P
INTERNAL
Internal Power Dissipation
—
W
P
INTERNAL
= I
DD
x V
DD(1)
TH06
P
I
/
O
I/O Power Dissipation
—
W
P
I
/
O
=
(I
OL
* V
OL
) +
(I
OH
* (V
DD
–
V
OH
))
TH07
P
DER
Derated Power
—
W
P
DER
= PD
MAX
(T
J
- T
A
)/θ
JA(2,3)
Note 1:
I
DD
is the current to run the chip alone without driving any load on the output pins.
2:
T
A
= Ambient Temperature.
3:
T
J
= Junction Temperature.