Microchip Technology MA330016 データシート

DS70290J-page 288

© 2007-2011 Microchip Technology Inc.

Added the 28-pin SSOP Thermal Packaging Characteristics (see 
Table 22-3).

Removed Note 4 from the DC Temperature and Voltage 
Specifications (see Table 22-4).

Updated the maximum value for parameters DI18 and DI19 and 
added parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O 
Pin Input Specifications (see Table 22-9).

Updated Note 3 in the PLL Clock Timing Specifications (see 
Table 22-17).

Removed Note 2 from the AC Characteristics: Internal RC Accuracy 
(see Table 22-18).

Updated the characteristic description for parameter DI35 in the I/O 
Timing Requirements (see Table 22-20).

Updated all SPI specifications (see Table 22-28 through Table 22-35 
and Figure 22-10 through Figure 22-16).

Added Note 4 to the 12-bit mode ADC Module Specifications (see 
Table 22-39).

Added Note 4 to the 10-bit mode ADC Module Specifications (see 
Table 22-40).

Updated all ambient temperature end range values to +150ºC 
throughout the chapter.
Updated the storage temperature end range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.

Updated Note 1 in the PLL Clock Timing Specifications (see 
Table 23-10).

Added Note 3 to the 12-bit Mode ADC Module Specifications (see 
Table 23-17).

Added Note 3 to the 10-bit Mode ADC Module Specifications (see 
Table 23-18).

Added the “SS” definition for the SSOP package.