Corsair TW3X2G1600C9DHXIN 2GB Kit TW3X2G1600C9DHXIN プリント
製品コード
TW3X2G1600C9DHXIN
www.corsair.com
The TW3X2G1600C9DHX is a 2048MByte matched pair of DDR3 SDRAM DIMMs built using
Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This
part delivers outstanding performance in the latest generation of dual-channel DDR3-based
motherboards. It has been tested extensively in popular DDR3 motherboards to ensure compatibility
and performance at its rated speed. This memory has been verified to operate at 1600MHz at the
low latencies of 9-9-9-24.
TW3X2G1600C9DHX
Every part is tested in Corsair's factory at 1600MHz, but your actual results may vary depending on the overclocking margin of your CPU and motherboard. Newer motherboards may be
used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance. RAM used on the module may
change without notice. © April 2008 Corsair Memory, Inc.
used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance. RAM used on the module may
change without notice. © April 2008 Corsair Memory, Inc.
FEATURES
2048 Megabytes of DDR3 memory
Two matched CM3X1G1600C9DHX
modules
Using DHX technology providing
maximum cooling
100% tested at 1600MHz in high performance
DDR3 motherboards
Lifetime warranty
TEST SPECS
Each module pair is tested together at
1600MHz
Tested and packaged in pairs
Packaged together immediately following
system test
Tested together at 1600MHz, Vdimm =
1.80V, at latency settings of 9-9-9-24
SPD programmed at:
JEDEC standard 9-9-9-24 values at
1333MHz
Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink