Intel Desktop Board DG31GL BLKDG31GL ユーザーズマニュアル

製品コード
BLKDG31GL
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 System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could 
  result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system  
  configuration and operating system.
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 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64  
  architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and  
 software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL 
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY  
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING 
TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
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*Other names and brands may be claimed as the property of others.
Copyright © 2008 Intel Corporation. All rights reserved. 0308/MS/DW/PDF 
 
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Technical Specifications
Processor  
Processor Support  
•  Intel® Core™2 Quad processor in the LGA775 
  package 
•  Intel® Core™2 Duo processor in the LGA775 
  package 
•  Intel® Pentium® Dual-Core processor in the 
  LGA775 package 
•  Intel® Celeron® processor in the 
  LGA775 package 
•  Supports Intel® 64 Architecture
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Intel® G31 Express Chipset 
•  Intel® G31 Express Chipset Graphics and 
  Memory Controller Hub 
•  Intel® 82801GB I/O Controller Hub (ICH7) 
•  Serial Peripheral Interface (SPI) Flash or  
  Firmware Hub (FWH)
Memory Controller Hub (MCH) 
•  Designed to support up to 4 GB of system 
  memory using DDR2 800 / 667 SDRAM 
  memory
Intel® ICH7 I/O Controller Hub 
•  One Ultra ATA100/66 Connector for two devices 
•  One Floppy Connector 
•  Two SATA (3.0 Gb/s) ports 
•  Intel® PRO 10/100 Network Connection 
•  Two PCI local bus slots
Integrated Intel® ICH7 controllers 
•  Four back-panel ports (two dual stack) 
•  Four additional ports (via two headers)
Firmware Hub
 
System BIOS  
•  4 Mb Flash EEPROM with Intel® Platform  
  Innovation Framework for EFI Plug and Play,  
  IDE drive auto-configure 
•  Advanced configuration and power interface 
  V1.0b, DMI 2.0, multilingual support
System Memory
 
Memory Capacity  
•  Two 240-pin DIMM connectors supporting  
  up to two double-sided DIMMs
Memory Types 
•  DDR2 800 / 667 SDRAM memory support 
•  Non-ECC Memory
Memory Modes 
•  Dual-channel operation support
Memory Voltage 
•  1.8V
Hardware Management 
•  Processor fan speed control 
•  System chassis fan speed control 
•  Voltage and temperature sensing 
•  Fan sensor inputs used to monitor fan activity 
•  Power management support for ACPI 2.0
Expansion Capabilities 
•  Two PCI bus add-in card connectors
Jumpers and Front-Panel Connectors
 
Jumpers 
•  Single configuration jumper design 
•  Jumper access for BIOS maintenance mode
Front-Panel Connectors 
•  Reset, HD LED, Power LEDs, power on/off 
•  One alternate power LED header (1x3) 
•  Two front-panel Hi-Speed USB 2.0 headers 
•  Front-panel audio header
Mechanical
 
Board Style  
•  ATX 2.2 compliant
Board Size 
•  9.6” x 8.6” (24.38 cm x 21.84 cm)
Baseboard Power Requirements 
•  ATX12V
Environment
 
Operating Temperature 
•  0°C to +55°C
Storage Temperature 
•  -40°C to +70°C
Regulations and Safety Standards
 
United States and Canada 
  CSA/UL 60950-1, First Edition  
  (Binational Standard) 
Europe 
  (Low Voltage Directive 2006/95/EC) 
  EN 60950-1:2006 
International 
  IEC 60950-1:2001, First Edition
EMC Regulations 
(tested in representative chassis) 
United States 
  FCC 47 CFR Part 15, Subpart B 
Canada 
  ICES-003 Class B 
Europe 
  (EMC Directive 2004/108/EC) 
  EN 55022:2006 and EN 55024:1998
Australia/New Zealand 
  EN 55022:2006 Class B 
Japan 
  VCCI V-3/04.04, V-4/03.04, Class B 
South Korea 
  KN-22:2005 and KN-24:2005
Taiwan 
  CNS 13438:2006 Class B 
International 
  CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance 
Europe 
  Europe RoHS (Directive 2002/95/EC) 
China 
  China RoHS (MII Order # 39)
Lead-Free: The symbol is used 
to identify electrical and electronic 
assemblies and components in which 
the lead (Pb) concentration level in 
any of the raw materials and the end product is 
not greater than 0.1% by weight (1000 ppm). This 
symbol is also used to indicate conformance to 
lead-free requirements and definitions adopted 
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
Ordering Information: See the Intel 
Web site at www.intel.com
For the most current product  
information, visit developer.intel.com/
design/motherbd/
For ENERGY STAR* recommended 
configurations, visit www.intel.com/
go/energystar