Atmel Evaluation Kit AT91SAM9260-EK AT91SAM9260-EK データシート
製品コード
AT91SAM9260-EK
41
SAM9260 [SUMMARY]
6221LS–ATARM–15-Oct-12
11.2 Soldering Profile
Note:
It is recommended to apply a soldering temperature higher than 250°C
A maximum of three reflow passes is allowed per component.
Table 11-5. Device and 208-lead PQFP Package Maximum Weight
5.5
g
Table 11-6. 208-lead PQFP Package Characteristics
Moisture Sensitivity Level
3
Table 11-7. Package Reference
JEDEC Drawing Reference
MS-022
JESD97 Classification
e3
Table 11-8. Soldering Profile
Profile Feature
PQFP208 Green Package
BGA217 Green Package
Average Ramp-up Rate (217°C to Peak)
3
⋅ C/sec. max.
3
⋅ C/sec. max.
Preheat Temperature 175°C ±25°C
180 sec. max.
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
60 sec. to 150 sec.
Time within 5
⋅ C of Actual Peak Temperature
20 sec. to 40 sec.
20 sec. to 40 sec.
Peak Temperature Range
260 +0
⋅ C
260 +0
⋅ C
Ramp-down Rate
6
⋅ C/sec. max.
6
⋅ C/sec. max.
Time 25
⋅ C to Peak Temperature
8 min. max.
8 min. max.