Atmel Evaluation Kit AT91SAM9G25-EK AT91SAM9G25-EK データシート
製品コード
AT91SAM9G25-EK
1081
SAM9G25 [DATASHEET]
11032C–ATARM–25-Jan-13
47.3
Marking
All devices are marked with the Atmel logo and the ordering code.
Additional marking may be in one of the following formats:
where
z
“YY”: manufactory year
z
“WW”: manufactory week
z
“V”: revision
z
“XXXXXXXXX”: lot number
Table 47-10. Ball Information
Ball Pitch
0.5 mm +/- 0.05
Ball Diameter
0.3 mm +/- 0.05
Table 47-11. Package Information
BGA Substrate Ball Land
0.25 mm +/- 0.05
Solder Mask Opening
0.275 mm +/- 0.05
Table 47-12. Device and 247-ball BGA Package Maximum Weight
177
mg
Table 47-13. 247-ball BGA Package Characteristics
Moisture Sensitivity Level
3
Table 47-14. Package Reference
JEDEC Drawing Reference
none
JESD97 Classification
e8
YYWW V
XXXXXXXXX
XXXXXXXXX
ARM