Linear Technology LTM8048 Demo Board, 725VDC Isolated µModule, 4.5V ≤ VIN ≤ 30V, VOUT = 5V @ 110mA to 370mA, LDO Post-Regulated Flyback Li DC1560A データシート
製品コード
DC1560A
LTM8048
18
8048ff
PACKAGE DESCRIPTION
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.
5. PRIMAR
Y DA
TUM -Z- IS SEA
TING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
PACKAGE ROW AND COLUMN LABELING MA
Y V
AR
Y
AMONG µModule PRODUCTS. REVIEW EACH P
ACKAGE
LA
YOUT CAREFULL
Y
!
PACKAGE TOP VIEW
4
PIN “A1” CORNER
Y
X
aaa Z
aaa Z
DET
AIL A
PACKAGE BOT
TOM VIEW
3
SEE NOTES
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
PIN 1
BGA 45 1212 REV A
TRA
Y PIN 1 BEVEL
PACKAGE IN TRA
Y LOADING ORIENT
ATION
COMPONENT
PIN “A1”
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNA
TION PER JESD MS-028 AND JEP95
4
3
DET
AILS OF PIN #1 IDENTIFIER ARE OP
TIONAL,
BUT MUST BE LOCA
TED WITHIN THE ZONE INDICA
TED.
THE PIN #1 IDENTIFIER MA
Y BE EITHER A MOLD OR
MARKED FEA
TURE
DET
AIL A
Øb (45 PLACES)
DET
AIL B
SUBSTRA
TE
0.27 – 0.37
3.95 – 4.05
// bbb Z
A
A1
b1
ccc Z
DET
AIL B
PACKAGE SIDE VIEW
MOLD CAP
Z
M
X
Y
Z
ddd
M
Z
eee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.71
0.60
NOM
4.92
0.60
4.32
0.78
0.63
11.25
9.0
1.27
8.89
7.62
MAX
5.12
0.70
4.42
0.85
0.66
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOT
AL NUMBER OF BALLS: 45
A2
D
E
e
b
F
G
SUGGESTED PCB LA
YOUT
TOP VIEW
0.000
0.635
1.905
0.635
3.175
1.905
4.445
3.175
4.445
3.810
2.540
1.270
3.810
2.540
1.270
0.3175
0.3175
0.000
4.1275
4.7625
LTMXXXXXX µModule
BGA Package
45-Lead (11.25mm
×
9.00mm
×
4.92mm)
(Reference LTC DWG # 05-08-1869 Rev A)
7
SEE NOTES