On Semiconductor NCL30082 Evaluation Board NCL30082FLYGEVB NCL30082FLYGEVB データシート

V

CC(MAX)

I

CC(MAX)

Maximum Power Supply voltage, VCC pin, continuous voltage

Maximum current for VCC pin

−0.3, +35

Internally limited

V

mA

V

DRV(MAX)

I

DRV(MAX)

Maximum driver pin voltage, DRV pin, continuous voltage

Maximum current for DRV pin

−0.3, V

DRV

−500, +800

V

mA

V

MAX

I

MAX

Maximum voltage on low power pins (except pins ZCD, DIM, DRV and VCC)

Current range for low power pins (except pins ZCD, DRV and VCC)

−0.3, +5.5

−2, +5

V

mA

V

ZCD(MAX)

I

ZCD(MAX)

Maximum voltage for ZCD pin

Maximum current for ZCD pin

−0.3, +10

−2, +5

V

mA

V

DIM(MAX)

Maximum voltage for DIM pin

−0.3, +10

V

R

θJ−A

Thermal Resistance, Junction−to−Air

289

°C/W

T

J(MAX)

Maximum Junction Temperature

150

°C

Operating Temperature Range

−40 to +125

°C

Storage Temperature Range

−60 to +150

°C

ESD Capability, HBM model (Note 2)

4

kV

ESD Capability, MM model  (Note 2)

200

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. V

DRV

 is the DRV clamp voltage V

DRV(high)

 when V

CC

 is higher than V

DRV(high)

. V

DRV

 is V

CC

 unless otherwise noted.

2. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per Mil−Std−883, Method 3015.

3. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78 except for VIN pin which passes 60 mA.