Nxp Semiconductors OM11043 データシート
LPC1769_68_67_66_65_64_63
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Product data sheet
Rev. 9.5 — 24 June 2014
82 of 89
NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
Fig 44. Reflow soldering of the TFBGA100 package
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
Hx
Hy
SOT926-1
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA100 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot926-1_fr
0.80
0.330
0.400
0.480
9.400
9.400