STMicroelectronics EVALHVLED815W10 and EVALHVLED815W15 Evaluation Board for the Offline LED Driver with Primary-Sensing and High Power Fact EVALHVLED815W10 データシート

製品コード
EVALHVLED815W10
ページ / 34
Pin description and connection diagrams
HVLED815PF
8/34
DocID023409  Rev 5
2.2 Thermal 
data
         
4
GND
Ground.
Current return for both the signal part of the IC and the gate drive. All of the ground 
connections of the bias components should be tied to a trace going to this pin and kept 
separate from any pulsed current return.
5
ILED
Constant current (CC) regulation loop reference voltage. 
An external capacitor C
LED
 is connected between this pin and GND. An internal circuit 
develops a voltage on this capacitor that is used as the reference for the MOSFET’s peak drain 
current during CC regulation. The voltage is automatically adjusted to keep the average output 
current constant.
6
DMG
Transformer demagnetization sensing for quasi-resonant operation and output voltage monitor. 
A negative-going edge triggers the MOSFET turn-on, to achieve quasi-resonant operation 
(zero voltage switching). 
The pin voltage is also sampled-and-held right at the end of transformer demagnetization to get 
an accurate image of the output voltage to be fed to the inverting input of the internal, 
transconductance-type, error amplifier, whose non-inverting input is referenced to 2.5 V. The 
maximum I
DMG
 sunk/sourced current must not exceed ± 2 mA (AMR) in all the V
IN
 range 
conditions. 
No capacitor is allowed between the pin and the auxiliary transformer.
7
COMP
Output of the internal transconductance error amplifier. The compensation network is placed 
between this pin and GND to achieve stability and good dynamic performance of the voltage 
control loop. 
8
N. A.
Not available. These pins must be connected to GND.
9 - 11
N. A.
Not available. These pins must be left not connected.
12
N. C.
Not internally connected. Provision for clearance on the PCB to meet safety requirements.
13 - 16
DRAIN
Drain connection of the internal power section. 
The internal high voltage startup generator sinks current from this pin as well. Pins connected 
to the internal metal frame to facilitate heat dissipation.
Table 2. Pin description (continued)
No.
Name
Function
Table 3. Thermal data
Symbol
Parameter
Max. value
Unit
R
thJP
Thermal resistance, junction to pin
10
°C/W
R
thJA
Thermal resistance, junction to ambient
110
°C/W
P
TOT
Maximum power dissipation at T
A
 = 50 °C
0.9
W
T
STG
Storage temperature range
-55 to 150
°C
T
J
Junction temperature range
-40 to 150
°C