Siemens SPS starter kit 6ED1057-3BA00-0AA8 12 Vdc, 24 Vdc 6ED1057-3BA00-0AA8 データシート
製品コード
6ED1057-3BA00-0AA8
LOGO! installation and wiring
2.1 Modular LOGO! setup
LOGO!
26
Manual, 06/2014, A5E33039675
What you must note when installing
LOGO! is designed for fixed and enclosed installation in the housing or the control cabinet.
WARNING
Attempts to install or wire LOGO! or related equipment with power applied could cause
electric shock or faulty operation of the equipment. Failure to disable all power to LOGO!
and related equipment during installation or removal procedures could result in death or
serious injury to personnel, and/or damage to equipment.
Always follow appropriate safety precautions and be sure to disconnect power from LOGO!
Always follow appropriate safety precautions and be sure to disconnect power from LOGO!
before attempting to install or remove LOGO! or related equipment.
Modules of a LOGO! are open facilities. This means that you must install LOGO! only in a
Modules of a LOGO! are open facilities. This means that you must install LOGO! only in a
housing or cabinet.
Allow access to the housings or cabinets only with the use of a key or a tool and only by
Allow access to the housings or cabinets only with the use of a key or a tool and only by
authorized or approved personnel.
You can operate LOGO! from the front at any time.
You can operate LOGO! from the front at any time.
Safety of electronic control equipment
Introduction
The notes below apply regardless of the type or manufacturer of the electronic control.
Reliability
Maximum reliability of LOGO! devices and components is achieved by implementing
The notes below apply regardless of the type or manufacturer of the electronic control.
Reliability
Maximum reliability of LOGO! devices and components is achieved by implementing
extensive and cost-effective measures during development and manufacture.
This includes the following:
● Use of high-quality components
● Design of all circuits for worst-case scenarios
● Systematic and computer-aided testing of all components
● Burn-in of all large-scale integrated circuits (for example, processors and memory)
● Prevention of static charge when handling MOS ICs (Metal Oxide Semiconducor
This includes the following:
● Use of high-quality components
● Design of all circuits for worst-case scenarios
● Systematic and computer-aided testing of all components
● Burn-in of all large-scale integrated circuits (for example, processors and memory)
● Prevention of static charge when handling MOS ICs (Metal Oxide Semiconducor
Integrated Circuits)
● Visual checks at different stages of manufacture
● Continuous heat-run test at elevated ambient temperature over a period of several days
● Careful computer-controlled final testing
● Statistical evaluation of all returned systems and components to enable the immediate
● Continuous heat-run test at elevated ambient temperature over a period of several days
● Careful computer-controlled final testing
● Statistical evaluation of all returned systems and components to enable the immediate
initiation of suitable corrective measures
● Monitoring of major control components, using online tests (cyclic interrupt for the CPU,
etc.)
These measures are referred to as basic measures.