Kingston Laptop RAM () DDR3L RAM 204-pin SO-DIMM HX316LS9IBK2/8 データシート

製品コード
HX316LS9IBK2/8
ページ / 2
DESCRIPTION
HyperX HX316LS9IBK2/8 is a kit of two 512M x 64-bit (4GB)
DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, low
voltage, memory modules, based on eight 512M x 8-bit DDR3
FBGA components per module. Total kit capacity is 8GB. Each
module kit has been tested to run at DDR3L-1600 at a low
latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing
parameters are shown in the PnP Timing Parameters section
below. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
Document No. 4807047-001.A00     05/20/14     Page 1
SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin)
48.125ns (min.)
Refresh to Active/Refresh
260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
33.75ns (min.)
Maximum Operating Power
TBD W* @1.35V
UL Rating
94 V - 0
Operating Temperature
0
o
 C to 85
o
 C
Storage Temperature
-55
o
 C to +100
o
 C
*Power will vary depending on the SDRAM used.
HX316LS9IBK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3L-1600
CL9 204-Pin SODIMM Kit
Continued >>
kingston.com/hyperx
PnP JEDEC TIMING PARAMETERS:
DDR3-1600 CL9-9-9 @1.35V or 1.5V
DDR3-1333 CL8-8-8 @1.35V or 1.5V
DDR3-1066 CL6-6-6 @1.35V or 1.5V
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
HX318C10FB/4
FEATURES
JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), double  sided  component