Cree MX6AWT-H1-0000-000BE5 Neutral white High Power LED, MX6AWT-H1-0000-000BE5 データシート
製品コード
MX6AWT-H1-0000-000BE5
Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the
Cree logo and XLamp are registered trademarks of Cree, Inc.
6
CLD-DS23.000
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
Reflow Soldering Characteristics
In testing, Cree has found XLamp MX-6 LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature
Lead-Based Solder
Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp)
3°C/second max.
3°C/second max.
Preheat: Temperature Min (Ts
min
)
100°C
150°C
Preheat: Temperature Max (Ts
max
)
150°C
200°C
Preheat: Time (ts
min
to ts
max
)
60-120 seconds
60-180 seconds
Time Maintained Above: Temperature (T
L
)
183°C
217°C
Time Maintained Above: Time (t
L
)
60-150 seconds
60-150 seconds
Peak/Classification Temperature (Tp)
215°C
260°C
Time Within 5°C of Actual Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6°C/second max.
6°C/second max
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.