Intel 4 620 JM80547PG0722MM データシート

製品コード

JM80547PG0722MM

Datasheet

Thermal Specifications and Design Considerations

The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in

Table 5-1

instead of the maximum processor power

consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to

Section 5.2

. In all cases, the Thermal Monitor feature

must be enabled for the processor to remain within specification.

Table 5-1. Processor Thermal Specifications

Processor

Name/Number

Core Frequency

(GHz)

Thermal

Design Power

(W)

Minimum T

(°C)

Maximum T

(°C)

Notes

Extreme Edition

3.73 (PRB = 1)

115

See

Table 5-2

and

Figure 5-1

1, 2

NOTES:

Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the
processor can dissipate.

This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum
T

will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed com-

binations of power and T

670/672

3.80 (PRB = 1)

115

See

Table 5-2

and

Figure 5-1

660/662

3.60 (PRB = 1)