Intel R2000BB4GS9 データシート
Intel
®
Server System R2000BB Product Family TPS
Revision 2.0
75
Appendix D: System Configuration Table for Thermal Compatibility
The following list reflects specified notes identified in the “Support Notes” column in the table. Each note reflects support criteria associated with a
specific system configuration. Notes that may not be specified in the table may reflect support criteria for a R1000BB Base System SKU described
in the appropriate 1U Technical Product Specification.
Table Notes:
specific system configuration. Notes that may not be specified in the table may reflect support criteria for a R1000BB Base System SKU described
in the appropriate 1U Technical Product Specification.
Table Notes:
1. The 25°C configuration alone is limited to elevations of 900m or less
2. Use of the designated PCI slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for air
2. Use of the designated PCI slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for air
flow requirements.
3. Fan redundancy is not supported in base system SKUs R2312BBxxxx and R2224BBxxxx, when any of the following IO modules are
installed: AXX10GBTWLIOM , AXX2FDRIBIOM, AXX1FDRIBIOM
4. Processor and Memory throttling may occur with a system fan failure, impacting system performance.
• For base system SKUs R2312BBxxxx and R2224BBxxxx, installing the following processors may have some performance impact under
A4: EN 95W-6C/8C, EN 80W-4C, EN 70W-8C
5. Specifically for A3/A4 individual Power Supply selection power margin is required to meet thermal specifications:
a) For dual power supply configuration, the power budget must fit within a single power supply rated load
b) For single power supply configuration, the power budget must be sized with 30% margin to single power supply rated load.
b) For single power supply configuration, the power budget must be sized with 30% margin to single power supply rated load.
6. Intel
®
Xeon Phi™ or Non-Intel GPGPU cards may have performance impact during ambient excursions
7. When identifying memory in the table, only Rank and Width are required. Capacity is not required.
8. LV refers to low voltage DIMMs (1.35V)
9. Installation of the AXXRMFBU2 in a 2U system will also require the installation of Intel mounting bracket A2UBKTMFBUSSD.The Cache
8. LV refers to low voltage DIMMs (1.35V)
9. Installation of the AXXRMFBU2 in a 2U system will also require the installation of Intel mounting bracket A2UBKTMFBUSSD.The Cache
offload Module can only be installed with 95W processors and DRx8 or equivalent memory.
10. Confirm the case temperature specification for the SSD to make appropriate selection
11. Fan fail of dual-rotor fans refers to one rotor fail. “Fan Fail Support” indicates if fan fail can be supported with specified configuration in each
11. Fan fail of dual-rotor fans refers to one rotor fail. “Fan Fail Support” indicates if fan fail can be supported with specified configuration in each
column.