Intel i5-4200H CL8064701470601 データシート
製品コード
CL8064701470601
8.0
Package Specifications
Package Mechanical Specifications
The processor is a Flip Chip technology package available in Ball Grid Array (BGA) and
reduced Pin Grid Array (rPGA) packages. The following table provides an overview of
the mechanical attributes of these packages.
Table 56.
Package Mechanical Attributes
Type
Parameter
Quad Core BGA
Processor with GT3
Graphics
(H-Processor Line)
Quad Core BGA
Processor with GT2
Graphics
(H-Processor Line)
Quad Core rPGA
Processor with GT2
Graphics
(M-Processor Line)
Package Technology
Package Type
Flip Chip Ball Grid Array
Flip Chip Ball Grid Array
Flip Chip Pin Grid
Array
Interconnect
Ball Grid Array (BGA)
Ball Grid Array (BGA)
Reduced Pin Grid
Array (rPGA)
rPGA946B/947 socket
Lead Free
Yes
Yes
Yes
Halogenated Flame
Retardant Free
Yes
Yes
Yes
Package
Configuration
Solder Ball
Composition
SAC405
SAC405
N/A
Ball/Pin Count
1364
1364
946
Grid Array Pattern
Balls Anywhere
Balls Anywhere
Square Array Pattern
Land Side Capacitors
Yes
Yes
Yes
Die Side Capacitors
Yes
Yes
Yes
Die Configuration
Multi-chip/2 dies
Monolithic
Monolithic
Package Dimensions
Nominal Package
Size
37.5 x 32.0 mm
37.5 x 32.0 mm
37.5 x 37.5 mm
Min Ball/Pin pitch
0.7 mm
0.7 mm
1.0 mm
The following two figures show the die orientation and relative non-critical to function
locations on the BGA and rPGA packages. The two BGA packages have the same
on
page 109 shows both die configurations overlaid on the same package footprint.
on page 110 shows a model of the rPGA946B/947 socket.
8.1
Processor—Package Specifications
Mobile 4th Generation Intel
®
Core
™
Processor Family, Mobile Intel
®
Pentium
®
Processor Family, and Mobile Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2
July 2014
108
Order No.: 328901-007