Telit Wireless Solutions GE863-QUAD ユーザーズマニュアル

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GE863-QUAD 
GE863-PY 
 
 1vv0300715 Rev. 1 - 19/09/06  
  
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved 
 
page 46 of 79 
 
8.3  General Design Rules 
There are several configurations for the audio output path, but the various design requirements can be 
grouped into three different categories: 
 
•  handset earphone (low power, typically a handset) 
•  hands-free earphone (low power, typically a earphone) 
•  car kit speakerphone (high power, typically a speaker)  
 
The three groups have different power requirements, usually the first two applications need only few 
mW of power, which can be directly drained from the GE863-QUAD / PY pads, provided a suited 
speaker is used. This direct connect design is the cheaper and simpler solution and will be suited for 
the most of the earphone design requirements. There's no need to decouple the output ear lines if a 
suited earpiece is connected. For the last group, the speakerphone, a power amplifier is required to 
raise the output power up to 5-10W required in a car cabin application. 
All the designs shall comply with the following guidelines: 
 
•  Where possible use a bridged earphone circuitry, to achieve the maximum power output from the 
device. 
•  Keep the earphone traces on the PCB and wires as short as possible. 
•  If your application requires a single ended earpiece and you want a direct connection, then leave 
one of the two output lines open and use only the other referred to ground. Remember that in this 
case the power output is 4 times lower than the bridged circuit and may not be enough to ensure 
a good voice volume.  
•  Make sure that the earphone traces in the PCB don't cross or run parallel to noisy traces 
(especially the power line)  
•  The cable to the speaker shall be a twisted pair with both the lines floating for the bridged output 
type, shielded with the shield to ground for the single ended output type. 
 
8.3.1  Noise Filtering 
The I/O of the PCB should have a noise filter close to the connector, to filter the high frequency GSM 
noise. The filter can be a Π formed by  2 capacitor and a inductance, with the one capacitor of  39pF - 
0603
 case , and the other capacitor of 1nF - 0603; the inductance shall have a value of 39μH .