Telit Wireless Solutions GE863-QUAD ユーザーズマニュアル

 
 
 
 

 

 

 1vv0300715 Rev. 1 - 19/09/06  

  

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved 

 

page 71 of 79 

 

Recommendations for PCB pad dimensions 
 

2 

1,150 

1 ± 0.05 

 
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist 
opening”, unless the microvia carry the same signal of the pad itself. 
 

 

 
 
Holes in pad are allowed only for blind holes and not for through holes. 
 
Recommendations for PCB pad surfaces: 
 

Electro-less Ni / 
Immersion Au 

3 –7 /  
0.05 – 0.15 

good solder ability protection, high 
shear force values 

 
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. 
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder 
paste on the described surface plating is better compared to lead-free solder paste. 

13.2.5 Solder 

paste 

 

 

Sn/Ag/Cu