FARGO electronic CUPS HDP5000 ユーザーズマニュアル

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Following the Resin Heat Front Procedure 
Command Line 
Usage 
CUPS option 
Description 
ResinHeatFront=0 
<-50 to 50> 
Resin Heat Front (K) = 0 
1.  Adjust the Resin Heat Front 
value higher to use more heat 
to transfer resin to a card.   
2.  Adjust the Resin Heat Front 
value lower to reduce the 
amount of heat (used to 
transfer resin to the card). 
 
Following the Resin Heat Back Procedure 
Command Line 
Usage 
CUPS option 
Description 
ResinHeatBack = 
<-50 to 50> 
Resin Heat Back (K) = 0 
1.  Adjust the Resin Heat Back value 
higher to use more heat and 
increase the transfer of resin to a 
card.   
2.  Adjust the Resin Heat Back value 
lower to reduce the amount of heat 
used and reduce the transfer of 
resin to the card. 
HDP5000 Cups (Linux & MAC OS) User Guide Rev1.1 
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