Intel Xeon X3440 BX80605X3440 ユーザーズマニュアル

36

Thermal/Mechanical Specifications and Design Guidelines

The socket will be tested against the conditions listed in 

 with heatsink and 

the ILM attached, under the loading conditions outlined in this section.

 provides load specifications for the LGA1156 socket with the ILM installed. 

The maximum limits should not be exceeded during heatsink assembly, shipping 
conditions, or standard use condition. Exceeding these limits during test may result in 
component failure. The socket body should not be used as a mechanical reference or 
load-bearing surface for thermal solutions.

1.

These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top 

surface.

2.

This is the minimum and maximum static force that can be applied by the heatsink and it’s retention 

solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated 

to these limits.

3.

Loading limits are for the LGA1156 socket.

4.

This minimum limit defines the static compressive force required to electrically seat the processor onto the 

socket contacts. The minimum load is a beginning of life load.

5.

Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load 

superimposed on the static load requirement.

6.

Test condition used a heatsink mass of 500gm [1.102 lb] with 50 g acceleration (table input) and an 

assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product 

application can have flexibility in specific values. The ultimate product of mass times acceleration plus static 

heatsink load should not exceed this limit.

7.

The maximum BOL value and must not be exceeded at any point in the product life. 

8.

The minimum value is a beginning of life loading requirement based on load degradation over time.

9.

The maximum removal force is the flick up removal upwards thumb force (measured at 45

o

), not applicable 

to SMT operation for system assembly. Only the minimum removal force is applicable to vertical removal in 

SMT operation for system assembly.

10. The maximum heatsink mass includes the heatsink, screws, springs, rings and cups. This mass limit is 

evaluated using the heatsink attach to the PCB.

ILM static compressive load on processor IHS

356 N [80 lbf]

600 N [135 lbf]

Heatsink static compressive load

0 N [0 lbf]

222 N [50 lbf]

Total static compressive Load 
(ILM plus Heatsink)

356 N [80 lbf]

822 N [185 lbf]

Dynamic Compressive Load 
(with heatsink installed) 

N/A

712 N [160 lbf] 

Pick & Place cover insertion force

N/A

10.2 N [2.3 lbf]

-

Pick & Place cover removal force

2.2N [0.5 lbf]

7.56 N [1.7 lbf]

Load lever actuation force

N/A

38.3 N [8.6 lbf] in the 

vertical direction 
10.2 N [2.3 lbf] in the 

lateral direction.

-

Maximum heatsink mass

N/A

500g