Intel Xeon X3440 BX80605X3440 ユーザーズマニュアル
製品コード
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
11
Introduction
§
TTV
Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater
in the die to evaluate thermal solutions.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)
Term
Description