Zhone Technologies Copper-Based Ethernet ユーザーズマニュアル
Bonding copper circuits for increased
Ethernet bandwidth
Ethernet bandwidth
The key innovation in EFM is the loop bonding of multiple copper circuits to provide
increased bandwidth. By intelligently distributing traffic across multiple circuits,
using very high-efficiency hardware processing, these multiple circuits appear to the
network as a single, high-bandwidth link, overcoming the limitations of individual
copper circuits.
increased bandwidth. By intelligently distributing traffic across multiple circuits,
using very high-efficiency hardware processing, these multiple circuits appear to the
network as a single, high-bandwidth link, overcoming the limitations of individual
copper circuits.
Two methods of hardware-based bonding are in widespread use, as described
below. Zhone offers both forms of bonding to provide maximum flexibility and
cost-effectiveness.
below. Zhone offers both forms of bonding to provide maximum flexibility and
cost-effectiveness.
802.3ah EFM
The IEEE 802.3ah standard for EFM, covering both fiber and copper Ethernet
applications, specifies the type of encoding used, bonding methodology for
copper, and OAM (Operations, Administration and Maintenance) support. Zhone
supports 802.3ah in our Ethernet aggregation line cards and EtherXtend SHDSL
EAD products.
applications, specifies the type of encoding used, bonding methodology for
copper, and OAM (Operations, Administration and Maintenance) support. Zhone
supports 802.3ah in our Ethernet aggregation line cards and EtherXtend SHDSL
EAD products.
HDLC-based Ethernet over Copper Bonding
HDLC-based bonding provides physical layer (PHY) bonding of DS1 / E1 / DS3 and
SHDSL circuits for highly efficient and reliable bandwidth gain. Widely deployed and
field proven, HDLC-based bonding is ideally suited for point-to-point and aggrega-
tion applications where simplicity and reliability are critical. Zhone supports HDLC-
based Ethernet over copper bonding technology in all of our EADs and aggregation
line cards.
SHDSL circuits for highly efficient and reliable bandwidth gain. Widely deployed and
field proven, HDLC-based bonding is ideally suited for point-to-point and aggrega-
tion applications where simplicity and reliability are critical. Zhone supports HDLC-
based Ethernet over copper bonding technology in all of our EADs and aggregation
line cards.
Grande Communications
Makes Carrier Ethernet
a Big Success
Makes Carrier Ethernet
a Big Success
“TheadditionofZhone’sEthernet
accesstechnologyincombination
withGrande’sextensivecopperand
fibernetworkcreatesanunparalleled
deliveryvehicle.Theuniqueabilityto
offertrue802.1Q-in-QTransparent
LANServicewiththerequisiteLayer
2and3controlsisanimportant
componentofthisproductoffering
forGrande.”
withGrande’sextensivecopperand
fibernetworkcreatesanunparalleled
deliveryvehicle.Theuniqueabilityto
offertrue802.1Q-in-QTransparent
LANServicewiththerequisiteLayer
2and3controlsisanimportant
componentofthisproductoffering
forGrande.”
Lamar Horton,
Director Network Engineering
Grande Communications
Zhone Delivers Higher
Bandwidth to Netmedia
Bandwidth to Netmedia
“UsingZhone'sEthernetoverCopper
solutionswithbothE1andSHDSL
lineshasenableddeliveryofhigher
bandwidthEthernetbusinessservices
inFinlandoverexistingcopperlines,
therebycreatingnewandprofitable
Ethernetbusinessservicesbyre-using
existingplant.”
lineshasenableddeliveryofhigher
bandwidthEthernetbusinessservices
inFinlandoverexistingcopperlines,
therebycreatingnewandprofitable
Ethernetbusinessservicesbyre-using
existingplant.”
Martin Sten, Founder
Netmedia, Finland