ユーザーズマニュアル (B80532PG0962M)目次Title Page1Contents3Revision History7Introduction 191.1 Terminology111.1.1 Processor Packaging Terminology111.2 References12Electrical Specifications 2152.1 System Bus and GTLREF152.2 Power and Ground Pins152.3 Decoupling Guidelines162.3.1 VCC Decoupling162.3.2 System Bus AGTL+ Decoupling162.4 Voltage Identification162.4.1 Phase Lock Loop (PLL) Power and Filter182.5 Reserved, Unused Pins, and TESTHI[12:0]202.6 System Bus Signal Groups212.7 Asynchronous GTL+ Signals222.8 Test Access Port (TAP) Connection222.9 System Bus Frequency Select Signals (BSEL[1:0])222.10 Maximum Ratings232.11 Processor DC Specifications232.12 AGTL+ System Bus Specifications35Package Mechanical Specifications 3373.1 Package Load Specifications403.2 Processor Insertion Specifications413.3 Processor Mass Specifications413.4 Processor Materials413.5 Processor Markings42Pin Lists and Signal Descriptions 4454.1 Processor Pin Assignments454.2 Signal Descriptions58Thermal Specifications and Design Considerations 5675.1 Processor Thermal Specifications685.1.1 Thermal Specifications685.1.2 Thermal Metrology705.1.2.1 Processor Case Temperature Measurement70Features 6716.1 Power-On Configuration Options716.2 Clock Control and Low Power States716.2.1 Normal State—State 1716.2.2 AutoHALT Powerdown State—State 2726.2.3 Stop-Grant State—State 3736.2.4 HALT/Grant Snoop State—State 4736.2.5 Sleep State—State 5746.3 Thermal Monitor746.3.1 Thermal Diode76Boxed Processor Specifications 7777.1 Introduction777.2 Mechanical Specifications787.2.1 Boxed Processor Cooling Solution Dimensions787.2.2 Boxed Processor Fan Heatsink Weight797.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly797.3 Electrical Requirements807.3.1 Fan Heatsink Power Supply807.4 Thermal Specifications827.4.1 Boxed Processor Cooling Requirements827.4.2 Variable Speed Fan83Debug Tools Specifications 8858.1 Logic Analyzer Interface (LAI)858.1.1 Mechanical Considerations858.1.2 Electrical Considerations85サイズ: 1.8MBページ数: 85Language: Englishマニュアルを開く