ユーザーズマニュアル (AW8063801118306)目次Mobile 3rd Generation Intel® Core™ Processor Family11 Introduction111.1 Processor Feature Details131.1.1 Supported Technologies131.2 Interfaces131.2.1 System Memory Support131.2.2 PCI Express*141.2.3 Direct Media Interface (DMI)151.2.4 Platform Environment Control Interface (PECI)161.2.5 Processor Graphics161.2.6 Embedded DisplayPort* (eDP*)171.2.7 Intel® Flexible Display Interface (Intel® FDI)171.3 Power Management Support171.3.1 Processor Core171.3.2 System171.3.3 Memory Controller171.3.4 PCI Express*171.3.5 DMI171.3.6 Processor Graphics Controller (GT)181.3.7 Thermal Management Support181.4 Mobile 3rd Generation Intel® Core™ Processor Family SKU Definition181.5 Package181.6 Processor Compatibility191.7 Terminology201.8 Related Documents222 Interfaces232.1 System Memory Interface232.1.1 System Memory Technology Supported232.1.2 System Memory Timing Support242.1.3 System Memory Organization Modes252.1.3.1 Single-Channel Mode252.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode252.1.4 Rules for Populating Memory Slots262.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)272.1.5.1 Just-in-Time Command Scheduling272.1.5.2 Command Overlap272.1.5.3 Out-of-Order Scheduling272.1.6 Data Scrambling272.1.7 DRAM Clock Generation272.1.8 DDR3 Reference Voltage Generation282.2 PCI Express* Interface282.2.1 PCI Express* Architecture282.2.1.1 Transaction Layer292.2.1.2 Data Link Layer292.2.1.3 Physical Layer292.2.2 PCI Express* Configuration Mechanism302.2.3 PCI Express* Graphics312.2.3.1 PCI Express* Lanes Connection312.3 Direct Media Interface (DMI)322.3.1 DMI Error Flow322.3.2 Processor/PCH Compatibility Assumptions322.3.3 DMI Link Down322.4 Processor Graphics Controller (GT)322.4.1 3D and Video Engines for Graphics Processing332.4.1.1 3D Engine Execution Units332.4.1.2 3D Pipeline342.4.1.3 Video Engine342.4.1.4 2D Engine352.4.2 Processor Graphics Display362.4.2.1 Display Planes362.4.2.2 Display Pipes372.4.2.3 Display Ports372.4.2.4 Embedded DisplayPort (eDP)372.4.3 Intel® Flexible Display Interface372.4.4 Multi Graphics Controllers Multi-Monitor Support382.5 Platform Environment Control Interface (PECI)382.6 Interface Clocking382.6.1 Internal Clocking Requirements383 Technologies393.1 Intel® Virtualization Technology393.1.1 Intel® VT-x Objectives393.1.2 Intel® VT-x Features403.1.3 Intel® VT-d Objectives403.1.4 Intel® VT-d Features403.1.5 Intel® VT-d Features Not Supported413.2 Intel® Trusted Execution Technology (Intel® TXT)413.3 Intel® Hyper-Threading Technology423.4 Intel® Turbo Boost Technology423.4.1 Intel®Turbo Boost Technology Frequency433.4.2 Intel® Turbo Boost Technology Graphics Frequency433.5 Intel® Advanced Vector Extensions (AVX)443.6 Security and Cryptography Technologies443.6.1 Advanced Encryption Standard New Instructions (AES-NI)443.6.2 PCLMULQDQ Instruction443.6.3 RDRAND Instruction453.7 Intel® 64 Architecture x2APIC453.8 Supervisor Mode Execution Protection (SMEP)463.9 Power Aware Interrupt Routing (PAIR)464 Power Management474.1 ACPI States Supported484.1.1 System States484.1.2 Processor Core/Package Idle States484.1.3 Integrated Memory Controller States484.1.4 PCI Express* Link States494.1.5 DMI States494.1.6 Processor Graphics Controller States494.1.7 Interface State Combinations494.2 Processor Core Power Management504.2.1 Enhanced Intel® SpeedStep® Technology504.2.2 Low-Power Idle States514.2.3 Requesting Low-Power Idle States524.2.4 Core C-states534.2.4.1 Core C0 State534.2.4.2 Core C1/C1E State534.2.4.3 Core C3 State534.2.4.4 Core C6 State534.2.4.5 Core C7 State544.2.4.6 C-State Auto-Demotion544.2.5 Package C-States544.2.5.1 Package C0564.2.5.2 Package C1/C1E564.2.5.3 Package C3 State564.2.5.4 Package C6 State564.2.5.5 Package C7 State574.2.5.6 Dynamic L3 Cache Sizing574.3 IMC Power Management574.3.1 Disabling Unused System Memory Outputs574.3.2 DRAM Power Management and Initialization584.3.2.1 Initialization Role of CKE594.3.2.2 Conditional Self-Refresh594.3.2.3 Dynamic Power Down Operation604.3.2.4 DRAM I/O Power Management604.3.3 DDR Electrical Power Gating (EPG)604.4 PCI Express* Power Management614.5 DMI Power Management614.6 Graphics Power Management614.6.1 Intel® Rapid Memory Power Management (RMPM) (also known as CxSR)614.6.2 Intel® Graphics Performance Modulation Technology (GPMT)614.6.3 Graphics Render C-State624.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT)624.6.5 Intel® Graphics Dynamic Frequency624.6.6 Display Power Savings Technology 6.0 (DPST)634.6.7 Automatic Display Brightness (ADB)634.6.8 Seamless Display Refresh Rate Switching Technology (SDRRST)634.7 Graphics Thermal Power Management645 Thermal Management655.1 Thermal Considerations655.2 Intel® Turbo Boost Technology Power Monitoring655.3 Intel® Turbo Boost Technology Power Control665.3.1 Package Power Control665.3.2 Power Plane Control685.3.3 Turbo Time Parameter685.4 Configurable TDP and Low Power Mode685.4.1 Configurable TDP685.4.2 Low Power Mode695.5 Thermal and Power Specifications705.6 Thermal Management Features735.6.1 Adaptive Thermal Monitor735.6.1.1 TCC Activation Offset745.6.1.2 Frequency/Voltage Control745.6.1.3 Clock Modulation765.6.2 Digital Thermal Sensor765.6.2.1 Digital Thermal Sensor Accuracy (Taccuracy)775.6.2.2 Fan Speed Control with Digital Thermal Sensor775.6.3 PROCHOT# Signal775.6.3.1 Bi-Directional PROCHOT#775.6.3.2 Voltage Regulator Protection versus PROCHOT#785.6.3.3 Thermal Solution Design and PROCHOT# Behavior785.6.3.4 Low-Power States and PROCHOT# Behavior785.6.3.5 THERMTRIP# Signal795.6.3.6 Critical Temperature Detection795.6.4 On-Demand Mode795.6.4.1 MSR Based On-Demand Mode795.6.4.2 I/O Emulation-Based On-Demand Mode795.6.5 Memory Thermal Management805.6.6 Platform Environment Control Interface (PECI)806 Signal Description816.1 System Memory Interface826.2 Memory Reference and Compensation846.3 Reset and Miscellaneous Signals846.4 PCI Express*-based Interface Signals856.5 Embedded DisplayPort (eDP)856.6 Intel® Flexible Display Interface Signals856.7 Direct Media Interface (DMI)866.8 Phase Lock Loop (PLL) Signals866.9 Test Access Points (TAP) Signals866.10 Error and Thermal Protection876.11 Power Sequencing886.12 Processor Power Signals896.13 Sense Signals896.14 Ground and NCTF906.15 Processor Internal Pull-Up / Pull-Down907 Electrical Specifications917.1 Power and Ground Pins917.2 Decoupling Guidelines917.2.1 Voltage Rail Decoupling917.2.2 PLL Power Supply917.3 Voltage Identification (VID)927.4 System Agent (SA) Vcc VID957.5 Reserved or Unused Signals957.6 Signal Groups967.7 Test Access Port (TAP) Connection987.8 Component Storage Condition Specifications (Prior to Board Attach)987.9 DC Specifications997.9.1 Voltage and Current Specifications997.10 Platform Environmental Control Interface (PECI) DC Specifications1067.10.1 PECI Bus Architecture1067.10.2 PECI DC Characteristics1077.10.3 Input Device Hysteresis1078 Processor Pin, Signal, and Package Information1098.1 Processor Pin Assignments1098.2 Package Mechanical Information1569 DDR Data Swizzling165サイズ: 4.12MBページ数: 168Language: Englishマニュアルを開く