Shanghai SIMCom Wireless Solutions Limited SIM7000G マニュアル

目次

• Contents

  4
• Table Index

  6
• Figure Index

  7
• Revision History

  9
• 1Introduction

  10
  • 1.1Product Outline

    10
  • 1.2Hardware Interface Overview

    11
  • 1.3Hardware Block Diagram

    12
  • 1.4Functional Overview

    13
• 2Package Information

  15
  • 2.1Pin Assignment Overview

    15
  • 2.2Pin Description

    17
  • 2.3Mechanical Information

    20
  • 2.4Footprint Recommendation

    21
• 3Interface Application

  22
  • 3.1Power Supply

    22
    • 3.1.1Power Supply Design Guide

      23
    • 3.1.2Recommended Power Supply Circuit

      23
    • 3.1.3Voltage Monitor

      24
  • 3.2Power on/Power off/Reset Function

    25
    • 3.2.1Power on

      25
    • 3.2.2Power off

      26
    • 3.2.3Reset Function

      27
  • 3.3UART Interface

    28
    • 3.3.1UART Design Guide

      28
    • 3.3.2RI and DTR Behavior

      29
  • 3.4USB Interface

    30
  • 3.5SIM Interface

    31
    • 3.5.1SIM Application Guide

      31
    • 3.5.2Recommended SIM Card Holder

      32
  • 3.6PCM Interface

    33
    • 3.6.1PCM timing

      33
    • 3.6.2PCM Application Guide

      35
  • 3.7I2C Interface

    35
  • 3.8Network status

    35
  • 3.9Other interface

    36
    • 3.9.1ADC

      36
    • 3.9.2LDO

      37
• 4RF Specifications

  38
  • 4.1LTE CAT-M1 RF Specifications

    38
• Maximum Power Reduction (MPR)

  40
  • 4.2LTE CAT-M1 Antenna Design Guide

    41
  • 4.3GNSS

    42
    • 4.3.1GNSS Technical specification

      42
    • 4.3.2GNSS Application Guide

      43
• 5Electrical Specifications

  45
  • 5.1Absolute maximum ratings

    45
  • 5.2Operating conditions

    45
  • 5.3Operating Mode

    46
    • 5.3.1Operating Mode Definition

      46
    • 5.3.2Sleep mode

      47
    • 5.3.3Minimum functionality mode and Flight mode

      47
  • 5.4Current Consumption

    48
  • 5.5ESD Notes

    49
• 6SMT Production Guide

  50
  • 6.1Top and Bottom View of SIM7000

    50
  • 6.2Label Information

    51
  • 6.3Typical SMT Reflow Profile

    52
  • 6.4Moisture Sensitivity Level (MSL)

    52
  • 6.5Stencil Foil Design Recommendation

    53
• 7Packaging

  53
  • 7.1tray packaging

    54
• Appendix

  57
  • A. Reference Design

    57
  • B. Related Documents

    58
  • C. Terms and Abbreviations

    60
  • D. Safety Caution

    62