Intel SL2YM 사용자 설명서
Pentium
®
II
Processor at 350 MHz, 400 MHz, and 450 MHz
6
Datasheet
7
Non-AGTL+ Signal Group DC Specifications...................................................... 24
8
AGTL+ Bus Specifications ................................................................................. 25
9
System Bus AC Specifications (Clock) at the Processor Edge Fingers ............. 26
10
System Bus AC Specifications (Clock) at Processor Core Pins ........................ 27
11
Valid System Bus, Core Frequency, and Cache Bus Frequencies .................... 27
12
System Bus AC Specifications (AGTL+ Signal Group)at the Processor
Edge Fingers ...................................................................................................... 28
Edge Fingers ...................................................................................................... 28
13
System Bus AC Specifications (AGTL+ Signal Group) at the Processor
Core Pins ........................................................................................................... 28
Core Pins ........................................................................................................... 28
14
System Bus AC Specifications (CMOS Signal Group) at the Processor
Edge
Edge
Fingers 29
15
System Bus AC Specifications (CMOS Signal Group)at the Processor Core
Pins
Pins
29
16
System Bus AC Specifications (Reset Conditions) ............................................ 30
17
System Bus AC Specifications (APIC Clock and APIC I/O) at the Processor
Edge Fingers ....................................................................................................... 30
Edge Fingers ....................................................................................................... 30
18
System Bus AC Specifications (APIC Clock and APIC I/O)at the Processor
Core Pins ........................................................................................................... 31
Core Pins ........................................................................................................... 31
19
System Bus AC Specifications (TAP Connection)at the Processor Edge
Fingers ............................................................................................................... 31
Fingers ............................................................................................................... 31
20
System Bus AC Specifications (TAP Connection)at the Processor Core Pins .. 32
21
BCLK Signal Quality Specifications for Simulation at the Processor Core ........ 37
22
BCLK Signal Quality Guidelines for Edge Finger Measurement ........................ 38
23
AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor
Core ................................................................................................................... 39
Core ................................................................................................................... 39
24
AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger
Measurement ..................................................................................................... 39
Measurement ..................................................................................................... 39
25
Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Core .................................................................................................. 41
Processor Core .................................................................................................. 41
26
Signal Ringback Guidelines for Non-AGTL+ Signal Edge Finger Measurement 41
27
Thermal Specifications for S.E.C.C. Packaged Processors ............................... 43
28
Thermal Specifications for S.E.C.C.2 Packaged Processors.............................. 43
29
Thermal Diode Parameters ................................................................................. 44
30
Thermal Diode Interface...................................................................................... 44
31
Description Table for Processor Markings (S.E.C.C. Packaged Processor)....... 52
32
Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)..... 57
33
S.E.C.C. Materials .............................................................................................. 57
34
S.E.C.C.2 Materials ............................................................................................ 57
35
Signal Listing in Order by Pin Number ................................................................ 58
36
Signal Listing in Order by Signal Name .............................................................. 61
37
Boxed Processor Fan Heatsink Spatial Dimensions ........................................... 69
38
Boxed Processor Fan Heatsink Support Dimensions ......................................... 70
39
Fan Heatsink Power and Signal Specifications................................................... 72
40
Motherboard Fan Power Connector Location ..................................................... 73
41
Signal Description ............................................................................................... 74
42
Output Signals..................................................................................................... 81
43
Input Signals ....................................................................................................... 82
44
Input/Output Signals (Single Driver).................................................................... 83
45
Input/Output Signals (Multiple Driver) ................................................................. 83