Texas Instruments TMS320C6727 사용자 설명서
www.ti.com
7.2.2
PowerPAD™ PCB Footprint
Thermal Pad on Top Copper
should be as large as Possible.
Soldermask opening should be smaller and match
the size of the thermal pad on the DSP.
7.3 Packaging Information
TMS320C6727, TMS320C6726, TMS320C6722
Floating-Point Digital Signal Processors
SPRS268E – MAY 2005 – REVISED JANUARY 2007
Texas Instruments'
(literature number
SLMA002) should be consulted when creating a PCB footprint for this device. In general, for proper
thermal performance, the thermal pad under the package body should be as large as possible. However,
the soldermask opening for the PowerPAD™ should be sized to match the pad size on the 144-pin RFP
package; as illustrated in
thermal performance, the thermal pad under the package body should be as large as possible. However,
the soldermask opening for the PowerPAD™ should be sized to match the pad size on the 144-pin RFP
package; as illustrated in
Figure 7-2. Soldermask Opening Should Match Size of DSP Thermal Pad
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
device(s). This data is subject to change without notice and without revision of this document.
On the 144-pin RFP package, the actual size of the Thermal Pad is 5.4 mm
×
5.4 mm.
Mechanical Data
109