Emerson MVME7100 사용자 설명서

Thermal Requirements

Hardware Preparation and Installation

MVME7100 Single Board Computer Installation and Use (6806800E08A)

2.3.3

Thermal Requirements

The MVME7100 module requires a minimum air flow of 10 CFM uniformly distributed across
the board, with the airflow traveling from the heat sink to the PMC2 site, when operating at a
55°C (131°F) ambient temperature.

2.3.4

Thermally Significant Components

The following table summarizes components that exhibit significant temperature rises. These
are the components that should be monitored in order to assess thermal performance. The
table also supplies the component reference designator and the maximum allowable operating
temperature.

You can find components on the board by their reference designators as shown in

Figure 2-1

and

Figure 2-2

on the next page. Versions of the board that are not fully populated may not

contain some of these components.

The preferred measurement location for a component may be junction, case, or ambient as
specified in the table. Junction temperature refers to the temperature measured by an on-chip
thermal device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.

Table 2-4 Thermally Significant Components

Reference
Designator

Generic Description

Maximum Allowable
Component Temperature
in Centigrade

Measurement Location

U27, U4

Gb Ethernet Transceiver

to +70

Ambient

U25, U26, U28

PCI-X/PCI-Express
Bridge

-40

to +85

Ambient

U22

PCI-Express Bridge

-40

to +85

Ambient

U24

VME Bridge

to + 70

Ambient

U10, U11, U12,
U13, U14, U56,
U57, U58, U59,
U6, U60, U61,
U62, U63, U64,
U7, U8, U9

DDR2 SDRAM

to +95

Case

U20

MPU

to +105

Junction