Cypress CY7C638xx 사용자 설명서
CY7C63310, CY7C638xx
Document 38-08035 Rev. *K
Page 77 of 83
Figure 31-3. 18-Pin (300-Mil) Molded DIP P3
Figure 31-4. 18-Pin (300-Mil) Molded SOIC S3
DIMENSIONS IN INCHES
MIN.
MAX.
SEATING PLANE
0.240
0.270
0.030
0.060
0.870
0.920
0.140
0.190
0.090
0.110
0.055
0.065
0.015
0.020
0.120
0.140
0.015
0.060
0.009
0.012
0.310
0.385
0.300
0.325
0.115
0.160
3° MIN.
1
9
10
18
PART #
LEAD FREE PKG.
STANDARD PKG.
PZ18.3
P18.3
51-85010 *B
PIN 1 ID
SEATING PLANE
0.447[11.353]
0.463[11.760]
0.463[11.760]
1
9
10
18
*
*
*
DIMENSIONS IN INCHES[MM]
MIN.
MAX.
MAX.
0.291[7.391]
0.300[7.620]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.032[0.812]
0.004[0.101]
REFERENCE JEDEC MO-119
PART #
S18.3 STANDARD PKG.
SZ18.3 LEAD FREE PKG.
51-85023-*B