Shuttle XPC Barebone SP35P2 Pro Black XPC-SP35P2 사용자 설명서

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XPC-SP35P2
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Product Specification
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Shuttle Computer Handels GmbH 
Fritz-Strassmann-Str. 5 
25337 Elmshorn | Germany
 
Tel. +49 (0) 4121-47 68 60 
Fax +49 (0) 4121-47 69 00 
sales@shuttle.eu
 
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Shuttle XPC Barebone SP35P2 Pro Specifications 
Special Pro-
Features 
Fingerprint recognition technology 
Speed-Link - easily connect 2 PCs via USB and share data 
Chassis 
P2-type aluminum chassis, color: black 
storage bays: 1 x 5.25", 3 x 3.5" (2 internal) 
stealthed drive doors 
dimensions: 32.5 x 22 x 21 cm (LWH) 
weight: 4.2 kg net / 6.0 kg gross 
Mainboard 
Shuttle FP35, Shuttle form factor, proprietary design for XPC SP35P2 Pro 
Chipset: Intel P35 Express (MCH, codename: Bearlake-X) + ICH9R (I/O Conroller Hub) 
Solid Capacitors for excellent heat resistance for enhanced system durability 
Color slots/connectors design (Power switch, USB, PCIe, PCI) 
Dimensions: 20.5 x 28 cm 
Power Supply 
400 Watt ATX mini PSU, AC input voltage: 100~240V 
80 PLUS® certified (80% or greater energy-efficient) 
Dimensions: 85(W) x 83(H) x150(D) mm 
Connectors: 2x3 pin (CPU power), 2x4 pin (mainboard power) 
Active PFC circuit (Power Factor Correction) 
Processor 
Support 
Socket 775 supports Single, Dual and Quad Core processors from Intel 
with Core technology and 800, 1066 or 1333MHz front side bus: 
Supports Core 2 Quad QX6xxx, Core 2 Duo 6xxx/4xxx,  
Pentium Dual-Core E2xxx, Celeron 4xx 
Designed for the upcoming Intel 45nm Core 2 multi-core processors 
Supports Pentium 4/D processors at 800MHz FSB. 
Processors with 533MHz FSB are not supported. 
Please refer the support list for detailed processor support information. 
Over- 
clocking *) 
CPU frequency, CPU voltage, RAM frequency, RAM voltage 
Dynamic Overclock feature: 
Easily overclock from 3/5/7/10/15/20% through the BIOS. 
Processor 
Cooling 
New Shuttle I.C.E. heat-pipe module (Integrated Cooling Engine) 
SilentX Cooling and Noise Reduction Technology 
advanced Heatpipe technology, linear fan control. 
3 independent cooling areas. 
OASIS Cooling Technology: additional fanless heat-pipe design 
covering the MOSFET modules (VRM), north- and southbridge 
Memory 
Support 
4 x 240 pin slots, supports Dual Channel 
supports DDR2-667/800 SDRAM memory 
(DDR2-1066 in overclocking mode*) 
max. 2 GB per DIMM,  up to a total size of 8 GB