Intel BOXDX79SR 사용자 설명서
PRoCeSSoR
Processor Support
• Intel® Core™ i7 processors in the LGA2011 package
• Intel® Turbo Boost Technology
• Intel® Core™ i7 processors in the LGA2011 package
• Intel® Turbo Boost Technology
2
• Intel® Hyper-Threading Technology
3
• Integrated Memory Controller with support for up
to 64 GB
4
of system memory DDR3 2400+ O.C.
SDRAM
• Intel® Fast Memory Access
• Supports Intel® 64 architecture
• Supports Intel® 64 architecture
6
CHIPSeT
Intel® X79 Express Chipset
• Intel® X79 PCH
• Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)
• Two SATA (6.0 Gb/s) and four SATA (3.0 Gb/s) ports
• Two SATA (6.0 Gb/s) via Marvell controller
• Intel® X79 PCH
• Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)
• Two SATA (6.0 Gb/s) and four SATA (3.0 Gb/s) ports
• Two SATA (6.0 Gb/s) via Marvell controller
USB PoRTS
• Six Hi-Speed USB 2.0 ports via back panel
• Eight additional Hi-Speed USB 2.0 ports via four
• Eight additional Hi-Speed USB 2.0 ports via four
internal headers
• Six Super-Speed USB 3.0 ports via NEC controller
SySTeM BIoS
• 64 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
IDE drive auto-configure
• Advanced configuration and power interface
V3.0b, DMI 2.5
fAST BooT
• Fast boot
• Intel® Express BIOS update support: BIOS update
• Intel® Express BIOS update support: BIOS update
via F7 function key
Intel® Desktop Board DX79SR Extreme Series
Technical Specifications
HARDWARe MANAGeMeNT feATUReS
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 3.0b
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 3.0b
INTeL® PRo 10/100/1000
NeTWoRk CoNNeCTIoN
NeTWoRk CoNNeCTIoN
• Dual Intel® LAN on the back panel
• New low-power design can meet Energy Star*
• New low-power design can meet Energy Star*
5.0 specifications
eXPANSIoN CAPABILITIeS
• Three PCI Express* x16 connectors (configured
as x16/x16/x8 in Tri graphics mode)
• Two PCI Express 2.0 x1 slots
• One PCI slot
• One PCI slot
AUDIo
• 10-channel Intel® High Definition Audio
5
codec
• 8-channel via the back panel
• 2-channel via the front panel
• Back panel support for output via optical cable
• One internal header for S/PDIF output for
• 2-channel via the front panel
• Back panel support for output via optical cable
• One internal header for S/PDIF output for
HDMI* support
SySTeM MeMoRy
Memory Capacity
• Eight 240-pin DIMM connectors supporting
• Eight 240-pin DIMM connectors supporting
quad channel memory. Two double-sided
DIMMS per channel
DIMMS per channel
• Maximum system memory up to 64 GB
7
using
8 GB double-sided DIMMs
Memory Types
• DDR3 2400+ O.C. SDRAM memory support
• Non-ECC Memory
Memory Modes
• Non-ECC Memory
Memory Modes
• Quad- or tri- or dual- or single-channel
operation support
Memory Voltage
• 1.35 V low voltage
• 1.5 V standard JEDEC voltage
• Support for Intel® XMP extended voltage profiles
• 1.35 V low voltage
• 1.5 V standard JEDEC voltage
• Support for Intel® XMP extended voltage profiles
JUMPeRS AND fRoNT PANeL CoNNeCToRS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front Panel Connectors
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Four front-panel Hi-Speed USB 2.0 headers
• One front-panel Super-Speed USB 3.0 headers
• Front-panel audio header
• One IEEE 1394a header
• Four front-panel Hi-Speed USB 2.0 headers
• One front-panel Super-Speed USB 3.0 headers
• Front-panel audio header
• One IEEE 1394a header
MeCHANICAL
Board Style
• ATX
Board Size
• 11.6¨ x 9.6¨ (29.46 cm x 24.38 cm)
Baseboard Power Requirements
• ATX 12 V
• ATX
Board Size
• 11.6¨ x 9.6¨ (29.46 cm x 24.38 cm)
Baseboard Power Requirements
• ATX 12 V
eNvIRoNMeNT
Operating Temperature
• 0° C to +55° C
Storage Temperature
• –20° C to +70° C
• 0° C to +55° C
Storage Temperature
• –20° C to +70° C
ReGULATIoNS AND SAfeTy STANDARDS
United States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
eMC Regulations (tested in
representative chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
eMC Regulations (tested in
representative chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
3