Intel L5630 AT80614005484AA 사용자 설명서

제품 코드

AT80614005484AA

Intel

Xeon

Processor 5600 Series Datasheet Volume 1

Contents

Introduction ............................................................................................................ 11
1.1

Processor Features ............................................................................................ 12

1.2

Platform Features.............................................................................................. 12

1.3

Terminology ..................................................................................................... 13

1.4

References ....................................................................................................... 15

1.5

Statement of Volatility ....................................................................................... 15

Electrical Specifications ........................................................................................... 17
2.1

Processor Signaling ........................................................................................... 17
2.1.1

Intel® QuickPath Interconnect ............................................................... 17

2.1.2

DDR3 Signal Groups.............................................................................. 17

2.1.3

Platform Environmental Control Interface (PECI) ....................................... 17

2.1.4

Processor Sideband Signals .................................................................... 18

2.1.5

System Reference Clock ........................................................................ 18

2.1.6

Test Access Port (TAP) Signals................................................................ 19

2.1.7

Power / Other Signals............................................................................ 19

2.1.8

Reserved or Unused Signals ................................................................... 27

2.2

Signal Group Summary ...................................................................................... 27

2.3

Mixing Processors.............................................................................................. 29

2.4

Flexible Motherboard Guidelines (FMB) ................................................................. 30

2.5

Absolute Maximum and Minimum Ratings ............................................................. 30

2.6

Processor DC Specifications ................................................................................ 31
2.6.1

VCC Overshoot Specifications ................................................................. 35

2.6.2

Die Voltage Validation ........................................................................... 36

2.7

Intel QuickPath Interconnect Specifications........................................................... 44

2.8

AC Specifications............................................................................................... 47

2.9

Processor AC Timing Waveforms ......................................................................... 54

Signal Quality Specifications.................................................................................... 65
3.1

Overshoot/Undershoot Tolerance......................................................................... 65

Package Mechanical Specifications .......................................................................... 67
4.1

Package Mechanical Specifications ....................................................................... 67
4.1.1

Package Mechanical Drawing .................................................................. 67

4.1.2

Processor Component Keep-Out Zones .................................................... 70

4.1.3

Package Loading Specifications............................................................... 70

4.1.4

Package Handling Guidelines .................................................................. 70

4.1.5

Package Insertion Specifications ............................................................. 70

4.1.6

Processor Mass Specification .................................................................. 71

4.1.7

Processor Materials ............................................................................... 71

4.1.8

Processor Markings ............................................................................... 71

Land Listing............................................................................................................. 73
5.1

Listing by Land Name ........................................................................................ 73

5.2

Listing by Land Number ..................................................................................... 90

Signal Definitions .................................................................................................. 109
6.1

Signal Definitions ............................................................................................ 109

Thermal Specifications .......................................................................................... 113
7.1

Package Thermal Specifications......................................................................... 113
7.1.1

Thermal Specifications......................................................................... 113

7.1.2

Thermal Metrology .............................................................................. 128

7.2

Processor Thermal Features .............................................................................. 128
7.2.1

Processor Temperature........................................................................ 128