HP 2533t mobile thin client 서비스 매뉴얼
3.
Remove the heat sink (2).
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
system board each time the heat sink is removed. Thermal paste is located on the processor (1)
and the section of the heat sink that services it (2). Thermal pads are located on the Northbridge
chip (3) and the section of the heat sink that services it (4). Replacement thermal material is
included with all heat sink and system board spare part kits.
and the section of the heat sink that services it (2). Thermal pads are located on the Northbridge
chip (3) and the section of the heat sink that services it (4). Replacement thermal material is
included with all heat sink and system board spare part kits.
Reverse this procedure to install the heat sink.
64
Chapter 4 Removal and replacement procedures