Panasonic ee23 사용자 설명서

Aluminum Electrolytic Capacitor

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

–

EE20

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2.4

Flow Soldering

(1) Don not immerse the c a p a c i t o r body into the

solder bath as excessive internal pressure could
result.

(2) Observe proper soldering conditions (temperature,

time, etc.). Do not exceed the specified limits.

(3) Do not allow other parts or components to touch

the capacitor during soldering.

2.5

Reflow Soldering for Chip Capacitors

(1) For reflow, use a thermal conduction system such

as infrared radiation (IR) or hot blast. Vapor heat
transfer systems (VPS) are not recommended.

(2) Observe proper soldering conditions (temperature,

time, etc.). Do not exceed the specified limits.

(3) Reflow should be performed one time. Consult us

for additional reflow restrictions.

2.7 Capacitor Handling after Soldering

(1) Avoid movement of the capacitor after soldering

to prevent excessive stress on the leadwires
where they enter the seal.

(2) Do not use the capacitor as a handle when

moving the circuit board assembly.

(3) Avoid striking the capacitor after assembly to

prevent failure due to excessive shock.

2.8

Circuit Board Cleaning

(1) Circuit boards can be immersed or ultrasonically

cleaned using suitable cleaning solvents for up
t o 5 m i n u t e s a n d u p t o 6 0

C m a x i m u m

temperatures. The boards should be thoroughly
rinsed and dried.
R e c o m m e n d e d c l e a n i n g s o l v e n t s i n c l u d e
Pine Alpha ST-100S, Sunelec B-12, DK Beclear
CW-5790, Aqua Cleaner 210SEP, Cold Cleaner
P3-375, Telpen Cleaner EC-7R, Clean-thru 750H,
Clean-thru 750L, Clean thru 710M, Techno
Cleaner 219, Techno Care FRW-17, Techno
Care FRW-1, Techno Care FRV-1, IPA (isopropyl
alcohol)

✽

The use of ozone depleting cleaning agents are
not recommended in the interest of protecting
the environment.

(2) Avoid using the following solvent groups unless

specifically allowed for in the specification;

●

Halogenated cleaning solvents: except for solvent
resistant capacitor types, halogenated solvents
c a n   p e r m e a t e   t h e   s e a l   a n d   c a u s e   i n t e r n a l
c a p a c i t o r  corrosion and failure. For solvent
r e s i s t a n t   c a p a c i t o r s ,   c a r e f u l l y   f o l l o w   t h e
t e m p e r a t u r e   a n d   t i m e   r e q u i r e m e n t s   o f   t h e
specificaion. 1-1-1 trichloroe thane should never
be used on any aluminium electrolytic capacitor.

●

Alkali solvents: could attack and dissolve the
aluminum case.

●

Petroleum based solvents: deterioration of the
rubber seal could result.

●

Xylene: deterioration of the rubber seal could
result.

●

Acetone: removal of the ink markings on the
vinyl sleeve could result.

Time in
200°C or more

250

200

150

100

120 (s)

5 (s)

Time

240

230

220

210

0 10 20 30 40 50 60

240

230

220

210

0 10 20 30 40 50 60

2.6 Other Soldering Considerations

R a p i d t e m p e r a t u r e r i s e s d u r i n g t h e p r e h e a t
operation and resin bonding operation can cause
cracking of the capacitor vinyl sleeve. For heat
curing, do not exceed 150

C for a maximum time of

2 minutes.

✽

T e m p e r a t u r e m e a s u r i n g m e t h o d : M e a s u r e
temperature in assuming quantitative production, by
sticking the thermo-couple to the capacitor upper
part with epoxy adhesives.

Peak
temperature

rts upper par

t temper

ature (

Chip capacitor reflow guaranteed condition

Time in 200

C or more (s)

(

3 to 6.3

)

eak temper

ature (

eak t

emper

ature

(

Time in 200

C or more (s)

(

8 to

φ10

)

160

240

230

220

210

0 10 20 30 40 50 60

EB Series

eak temper

ature (

Time in 200

C or more (s)

(

10 to

18)

Mar. 2005